Inventor

TSENG CHUN-HAO

TW48 patents

⚠️ This page may combine multiple inventors who share the name “TSENG CHUN-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSENG CHUN-HAO

TAIWAN SEMICONDUCTOR MFG CO LTD

Method to fabricate mask-pellicle system

Thermally conductive structure for heat dissipation in semiconductor packages

Package and method for integration of heterogeneous integrated circuits

Thermally conductive structure for heat dissipation in semiconductor packages

Package and method for integration of heterogeneous integrated circuits

Thermally conductive molding compound structure for heat dissipation in semiconductor packages

Method of fabrication polymer waveguide

Package and method for integration of heterogeneous integrated circuits

Method for forming semiconductor package using carbon nano material in molding compound

Thermally conductive molding compound structure for heat dissipation in semiconductor packages

Method of fabrication polymer waveguide

Vacuum carrier module, method of using and process of making the same

Waveguide structure and method for fabricating the same

Apparatus and method of forming laser chip package with waveguide for light coupling

Apparatus and package structure of optical chip

Thermally conductive molding compound structure for heat dissipation in semiconductor packages

Method for forming semiconductor package using carbon nano material in molding compound

Thermally conductive structure for heat dissipation in semiconductor packages

Method of fabrication polymer waveguide

Adhesion promoter apparatus and method

Optical bench on substrate

Adhesion promoter apparatus and method

Thermally conductive molding compound structure for heat dissipation in semiconductor packages

Method to fabricate mask-pellicle system

Thermally conductive molding compound structure for heat dissipation in semiconductor packages

Thermally conductive structure for heat dissipation in semiconductor packages

Method for forming semiconductor package using carbon nano material in molding compound

Vacuum carrier module, method of using and process of making the same

Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die

Adhesion promoter apparatus and method

Package and method for integration of heterogeneous integrated circuits

Method for forming semiconductor package using carbon nano material in molding compound

Apparatus and method of forming chip package with waveguide for light coupling

Apparatus and package structure of optical chip

TAIWAN SEMICONDUCTOR MFG

Light coupling formation in a waveguide layer

Optical element structure and optical element fabricating process for the same

Manufacture including substrate and package structure of optical chip

IND TECH RES INST

Methods for forming gas barriers on electronic devices

Method and apparatus for correcting wireless signal quality

TSENG CHUN-HAO

Method of fabricating a polymer waveguide

TSENG CHUN HAO

Attachable monitoring device

LEE WAN YU

Optical bench on substrate

IWEECARE CO LTD

Attachable monitoring device

INER AEC EXECUTIVE YUAN

Multivalent saccharide complex, radioactive multivalent saccharide complex contrast agent, and use thereof

HTC CORP

Method for encrypting on-screen contents, electronic apparatus using the method and recording medium using the method

MASSACHUSETTS INST TECHNOLOGY

Nanoparticle synthesis

GRADE HACEK OVER C AK SILVIJA

Nanoparticle synthesis

GRADECAK SILVIJA

Nanowire synthesis