Inventor
WIJEKOON KAPILA
US16 patents
⚠️ This page may combine multiple inventors who share the name “WIJEKOON KAPILA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
15 patentsUS6537144B1Mar 25, 2003
Method and apparatus for enhanced CMP using metals having reductive properties
APPLIED MATERIALS INC145 citations99
US6309276B1Oct 30, 2001
Endpoint monitoring with polishing rate change
APPLIED MATERIALS INC85 citations98
US6561873B2May 13, 2003
Method and apparatus for enhanced CMP using metals having reductive properties
APPLIED MATERIALS INC66 citations96
US6146259ANov 14, 2000
Carrier head with local pressure control for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC81 citations96
US6511367B2Jan 28, 2003
Carrier head with local pressure control for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC17 citations93
US7651934B2Jan 26, 2010
Process for electroless copper deposition
APPLIED MATERIALS INC25 citations92
US6790768B2Sep 14, 2004
Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects
APPLIED MATERIALS INC13 citations92
US6638143B2Oct 28, 2003
Ion exchange materials for chemical mechanical polishing
APPLIED MATERIALS INC41 citations92
US6572453B1Jun 3, 2003
Multi-fluid polishing process
APPLIED MATERIALS INC25 citations92
US7070480B2Jul 4, 2006
Method and apparatus for polishing substrates
APPLIED MATERIALS INC24 citations91
US6218306B1Apr 17, 2001
Method of chemical mechanical polishing a metal layer
APPLIED MATERIALS INC31 citations90
US6620027B2Sep 16, 2003
Method and apparatus for hard pad polishing
APPLIED MATERIALS INC14 citations83
US6368191B1Apr 9, 2002
Carrier head with local pressure control for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC10 citations74
US6960521B2Nov 1, 2005
Method and apparatus for polishing metal and dielectric substrates
APPLIED MATERIALS INC6 citations73
US7153188B1Dec 26, 2006
Temperature control in a chemical mechanical polishing system
APPLIED MATERIALS INC6 citations63