Inventor
WISE MICHAEL
US31 patents
⚠️ This page may combine multiple inventors who share the name “WISE MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TURNER BROADCASTING SYS INC
8 patentsUS9875318B2Jan 23, 2018
Concepts for providing an enhanced media presentation
TURNER BROADCASTING SYS INC6 citations82
US10540418B2Jan 21, 2020
Concepts for providing an enhanced media presentation
TURNER BROADCASTING SYS INC2 citations71
US9934322B2Apr 3, 2018
Concepts for providing an enhanced media presentation
TURNER BROADCASTING SYS INC2 citations71
US9798828B2Oct 24, 2017
Concepts for providing an enhanced media presentation
TURNER BROADCASTING SYS INC2 citations71
US9792386B2Oct 17, 2017
Concepts for providing an enhanced media presentation
TURNER BROADCASTING SYS INC2 citations70
US10025875B2Jul 17, 2018
Concepts for providing an enhanced media presentation
TURNER BROADCASTING SYS INC1 citations60
US10635737B2Apr 28, 2020
Concepts for providing an enhanced media presentation
TURNER BROADCASTING SYS INC0 citations50
US9965568B2May 8, 2018
Concepts for providing an enhanced media presentation
TURNER BROADCASTING SYS INC0 citations50
INFINEON TECHNOLOGIES AG
5 patentsUS6821865B2Nov 23, 2004
Deep isolation trenches
INFINEON TECHNOLOGIES AG33 citations93
US6437401B1Aug 20, 2002
Structure and method for improved isolation in trench storage cells
INFINEON TECHNOLOGIES AG38 citations92
US6794705B2Sep 21, 2004
Multi-layer Pt electrode for DRAM and FRAM with high K dielectric materials
INFINEON TECHNOLOGIES AG10 citations73
US6596580B2Jul 22, 2003
Recess Pt structure for high k stacked capacitor in DRAM and FRAM, and the method to form this structure
INFINEON TECHNOLOGIES AG12 citations73
US7319270B2Jan 15, 2008
Multi-layer electrode and method of forming the same
INFINEON TECHNOLOGIES AG4 citations62
IBM
4 patentsUS6420216B1Jul 16, 2002
Fuse processing using dielectric planarization pillars
IBM331 citations99
US6348395B1Feb 19, 2002
Diamond as a polish-stop layer for chemical-mechanical planarization in a damascene process flow
IBM25 citations92
US6696759B2Feb 24, 2004
Semiconductor device with diamond-like carbon layer as a polish-stop layer
IBM7 citations74
US7270884B2Sep 18, 2007
Adhesion layer for Pt on SiO2
IBM2 citations62