Inventor
HWANG YI-SUNG
KR5 patents
⚠️ This page may combine multiple inventors who share the name “HWANG YI-SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
4 patentsUS7850087B2Dec 14, 2010
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD100 citations96
US6653727B2Nov 25, 2003
Semiconductor chip package with direction-flexible mountability
SAMSUNG ELECTRONICS CO LTD6 citations72
US7502231B2Mar 10, 2009
Thin printed circuit board for manufacturing chip scale package
SAMSUNG ELECTRONICS CO LTD3 citations60
US7323642B2Jan 29, 2008
Thin printed circuit board for manufacturing chip scale package
SAMSUNG ELECTRONICS CO LTD4 citations60