Inventor
JIN HO-TAE
KR14 patents
⚠️ This page may combine multiple inventors who share the name “JIN HO-TAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
12 patentsUS6121118ASep 19, 2000
Chip separation device and method
SAMSUNG ELECTRONICS CO LTD149 citations98
US5979739ANov 9, 1999
Semiconductor die bonding apparatus having multiple bonding system
SAMSUNG ELECTRONICS CO LTD59 citations94
US5765277AJun 16, 1998
Die bonding apparatus with a revolving pick-up tool
SAMSUNG ELECTRONICS CO LTD65 citations94
US6386432B1May 14, 2002
Semiconductor die pickup method that prevents electrostatic discharge
SAMSUNG ELECTRONICS CO LTD19 citations92
US6321971B1Nov 27, 2001
Die collet for a semiconductor chip and apparatus for bonding semiconductor chip to a lead frame
SAMSUNG ELECTRONICS CO LTD23 citations92
US6207478B1Mar 27, 2001
Method for manufacturing semiconductor package of center pad type device
SAMSUNG ELECTRONICS CO LTD24 citations89
US5684328ANov 4, 1997
Semiconductor chip package using improved tape mounting
SAMSUNG ELECTRONICS CO LTD19 citations88
US6787393B2Sep 7, 2004
Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor package
SAMSUNG ELECTRONICS CO LTD17 citations83
US6392286B1May 21, 2002
Semiconductor chip packaging system and a semiconductor chip packaging method using the same
SAMSUNG ELECTRONICS CO LTD9 citations71
US9252123B2Feb 2, 2016
Multi-chip package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations67
US7502231B2Mar 10, 2009
Thin printed circuit board for manufacturing chip scale package
SAMSUNG ELECTRONICS CO LTD3 citations60
US7323642B2Jan 29, 2008
Thin printed circuit board for manufacturing chip scale package
SAMSUNG ELECTRONICS CO LTD4 citations60