Inventor

GRUNOW STEPHAN

US44 patents

⚠️ This page may combine multiple inventors who share the name “GRUNOW STEPHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GRUNOW STEPHAN

IBM

Structure and method of chemically formed anchored metallic vias

Interconnect structure for integrated circuits having improved electromigration characteristics

Gap free anchored conductor and dielectric structure and method for fabrication thereof

E-fuse structures and methods of manufacture

Self-aligned patterned etch stop layers for semiconductor devices

Structure and method of forming electrically blown metal fuses for integrated circuits

Structure and method for hybrid tungsten copper metal contact

Back-end electrically programmable fuse

Stacked via structure for metal fuse applications

Structures and methods for reduction of parasitic capacitances in semiconductor integrated circuits

Reliability of wide interconnects

Gap free anchored conductor and dielectric structure and method for fabrication thereof

Self-aligned contact

Method for forming conductive structures

Test structure for determining optimal seed and liner layer thicknesses for dual damascene processing

Interconnect structures comprising capping layers with low dielectric constants and methods of making the same

Stacked via structure for metal fuse applications

Stacked via structure for metal fuse applications

Method of forming a structure for reducing lateral fringe capacitance in semiconductor devices

TEXAS INSTRUMENTS INC

Measurement of wafer temperature in semiconductor processing chambers

Partial plate anneal plate process for deposition of conductive fill material

Use of supercritical fluid for low effective dielectric constant metallization

Air gap in integrated circuit inductor fabrication

Method of fabricating robust nucleation/seed layers for subsequent deposition/fill of metallization layers

Single mask MIM capacitor and resistor with in trench copper drift barrier

Integration of pore sealing liner into dual-damascene methods and devices

Metal insulator metal (MIM) capacitor fabrication with sidewall barrier removal aspect

Contact resistance reduction by new barrier stack process

Use of supercritical fluid for low effective dielectric constant metallization

Multilayer integrated circuit copper plateable barriers

Method of fabrication of on-chip heat pipes and ancillary heat transfer components

Air gap in integrated circuit inductor fabrication

Manufacturable reliable diffusion-barrier

BONILLA GRISELDA

Metal fuse structure for improved programming capability

Interconnect structure for integrated circuits having enhanced electromigration resistance

Capping of copper interconnect lines in integrated circuit devices

Fuse and integrated conductor

E-fuse structures and methods of manufacture

FILIPPI RONALD G

Stacked via structure for metal fuse applications

Redundant via structure for metal fuse applications

BAO JUNJING

Back-end electrically programmable fuse

GLOBALFOUNDRIES INC

Metal fuse structure for improved programming capability

CHENG TIEN-JEN

Method for removing copper oxide layer

ARUNACHALAM VALLI

Properties of metallic copper diffusion barriers through silicon surface treatments