Inventor
HSU CHAO-SHUN
TW9 patents
⚠️ This page may combine multiple inventors who share the name “HSU CHAO-SHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
6 patentsUS7427803B2Sep 23, 2008
Electromagnetic shielding using through-silicon vias
TAIWAN SEMICONDUCTOR MFG84 citations97
US7494846B2Feb 24, 2009
Design techniques for stacking identical memory dies
TAIWAN SEMICONDUCTOR MFG42 citations92
US7795735B2Sep 14, 2010
Methods for forming single dies with multi-layer interconnect structures and structures formed therefrom
TAIWAN SEMICONDUCTOR MFG30 citations90
US8945998B2Feb 3, 2015
Programmable semiconductor interposer for electronic package and method of forming
TAIWAN SEMICONDUCTOR MFG15 citations83
US7812426B2Oct 12, 2010
TSV-enabled twisted pair
TAIWAN SEMICONDUCTOR MFG14 citations83
US7565635B2Jul 21, 2009
SiP (system in package) design systems and methods
TAIWAN SEMICONDUCTOR MFG9 citations80