Inventor
CHEN AIHUA
CN32 patents
⚠️ This page may combine multiple inventors who share the name “CHEN AIHUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
22 patentsUS7172792B2Feb 6, 2007
Method for forming a high quality low temperature silicon nitride film
APPLIED MATERIALS INC135 citations98
US6833161B2Dec 21, 2004
Cyclical deposition of tungsten nitride for metal oxide gate electrode
APPLIED MATERIALS INC143 citations98
US5906683AMay 25, 1999
Lid assembly for semiconductor processing chamber
APPLIED MATERIALS INC129 citations98
US6713127B2Mar 30, 2004
Methods for silicon oxide and oxynitride deposition using single wafer low pressure CVD
APPLIED MATERIALS INC82 citations96
US6303501B1Oct 16, 2001
Gas mixing apparatus and method
APPLIED MATERIALS INC66 citations96
US5763851AJun 9, 1998
Slotted RF coil shield for plasma deposition system
APPLIED MATERIALS INC93 citations96
US5691876ANov 25, 1997
High temperature polyimide electrostatic chuck
APPLIED MATERIALS INC74 citations96
US7745329B2Jun 29, 2010
Tungsten nitride atomic layer deposition processes
APPLIED MATERIALS INC36 citations95
US6231674B1May 15, 2001
Wafer edge deposition elimination
APPLIED MATERIALS INC53 citations95
US6033480AMar 7, 2000
Wafer edge deposition elimination
APPLIED MATERIALS INC51 citations95
US5536330AJul 16, 1996
Method of purging and pumping vacuum chamber to ultra-high vacuum
APPLIED MATERIALS INC57 citations95
US7429516B2Sep 30, 2008
Tungsten nitride atomic layer deposition processes
APPLIED MATERIALS INC12 citations92
US7115499B2Oct 3, 2006
Cyclical deposition of tungsten nitride for metal oxide gate electrode
APPLIED MATERIALS INC28 citations92
US6068703AMay 30, 2000
Gas mixing apparatus and method
APPLIED MATERIALS INC51 citations92
US5908334AJun 1, 1999
Electrical connector for power transmission in an electrostatic chuck
APPLIED MATERIALS INC41 citations92
US5868847AFeb 9, 1999
Clamp ring for shielding a substrate during film layer deposition
APPLIED MATERIALS INC34 citations92
US5759287AJun 2, 1998
Method of purging and passivating a semiconductor processing chamber
APPLIED MATERIALS INC33 citations92
US6884464B2Apr 26, 2005
Methods for forming silicon comprising films using hexachlorodisilane in a single-wafer deposion chamber
APPLIED MATERIALS INC21 citations89
US6500266B1Dec 31, 2002
Heater temperature uniformity qualification tool
APPLIED MATERIALS INC30 citations88
US7335266B2Feb 26, 2008
Method of forming a controlled and uniform lightly phosphorous doped silicon film
APPLIED MATERIALS INC7 citations72
US6982214B2Jan 3, 2006
Method of forming a controlled and uniform lightly phosphorous doped silicon film
APPLIED MATERIALS INC7 citations72
US6143084ANov 7, 2000
Apparatus and method for generating plasma
APPLIED MATERIALS INC14 citations71
CHEN AIHUA
4 patentsUS8715418B2May 6, 2014
Semiconductor processing system; a semiconductor processing chamber; and a method for loading, unloading and exchanging semiconductor work pieces from a semiconductor processing chamber
CHEN AIHUA10 citations83
US8336488B2Dec 25, 2012
Multi-station plasma reactor with multiple plasma regions
CHEN AIHUA11 citations83
USD1025430SApr 30, 2024
Solar lamp
CHEN AIHUA2 citations72
US9947562B2Apr 17, 2018
Method and apparatus for processing semiconductor work pieces
CHEN AIHUA2 citations70