Inventor
GAN KAH WEE
SG12 patents
⚠️ This page may combine multiple inventors who share the name “GAN KAH WEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GAN KAH WEE
6 patentsUS8916481B2Dec 23, 2014
Embedded wafer level package for 3D and package-on-package applications, and method of manufacture
GAN KAH WEE33 citations92
US8779601B2Jul 15, 2014
Embedded wafer level package for 3D and package-on-package applications, and method of manufacture
GAN KAH WEE34 citations92
US8617987B2Dec 31, 2013
Through hole via filling using electroless plating
GAN KAH WEE7 citations82
US8766422B2Jul 1, 2014
Through hole via filling using electroless plating
GAN KAH WEE3 citations61
US8728831B2May 20, 2014
Reconstituted wafer warpage adjustment
GAN KAH WEE1 citations51
US8912653B2Dec 16, 2014
Plasma treatment on semiconductor wafers
GAN KAH WEE0 citations39
GLOBALFOUNDRIES SG PTE LTD
4 patentsUS10468457B1Nov 5, 2019
Magnetic random access memory structures and integrated circuits with cobalt anti-parallel layers, and methods for fabricating the same
GLOBALFOUNDRIES SG PTE LTD9 citations82
US11742283B2Aug 29, 2023
Integrated thin film resistor and memory device
GLOBALFOUNDRIES SG PTE LTD0 citations61
US11335635B2May 17, 2022
Thin film resistors of semiconductor devices
GLOBALFOUNDRIES SG PTE LTD0 citations59
US9842989B2Dec 12, 2017
Magnetic memory with high thermal budget
GLOBALFOUNDRIES SG PTE LTD0 citations51