Inventor

LEE WHONCHEE

US78 patents

⚠️ This page may combine multiple inventors who share the name “LEE WHONCHEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE WHONCHEE

MICRON TECHNOLOGY INC

Methods and apparatuses for planarizing microelectronic substrate assemblies

Methods of shaping vertical single crystal silicon walls and resulting structures

Wet etch suitable for creating square cuts in si

Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids

Method and apparatus for chemical-mechanical planarization of microelectronic substrates with selected planarizing liquids

Process for selectively etching silicon nitride in the presence of silicon oxide

Method and composition for selectively etching against cobalt silicide

Selective etching of oxides

Methods and etchants for etching oxides of silicon with low selectivity in a vapor phase system

Methods and apparatuses for electrochemical-mechanical polishing

High selectivity BPSG to TEOS etchant

Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate

Methods and apparatuses for electrochemical-mechanical polishing

Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate

Electro-mechanically polished structure

Composition for selectively etching against cobalt silicide

Capacitor structures with recessed hemispherical grain silicon

Electro-mechanical polishing of platinum container structure

Composition and method of formation and use therefor in chemical-mechanical polishing

Resistance-reducing conductive adhesives for attachment of electronic components

High selectivity BPSG to TEOS etchant

Process for selectively etching silicon nitride in the presence of silicon oxide

Noncontact localized electrochemical deposition of metal thin films

Method for in situ removal of particulate residues resulting from cleaning treatments

Method for in situ removal of particulate residues resulting from hydrofluoric acid cleaning treatments

Methods and etchants for etching oxides of silicon with low selectivity

Compositions for etching silicon with high selectivity to oxides and methods of using same

Compositions for etching silicon with high selectivity to oxides and methods of using same

Method for selective etching of antireflective coatings

Method for selective etching of antireflective coatings

Method for selective etching of anitreflective coatings

Electroplating systems

Semiconductor structures including square cuts in single crystal silicon

Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates

Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate

Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate

Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material

Method and composition for selectively etching against cobalt silicide

Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces

Methods and apparatus for selectively removing conductive material from a microelectronic substrate

Methods and apparatus for removing conductive material from a microelectronic substrate

Resistance-reducing conductive adhesives for attachment of electronic components

Capacitor structures with recessed hemispherical grain silicon

Resistance-reducing conductive adhesives for attachment of electronic components

Methods and etchants for etching oxides of silicon with low selectivity

Semiconductor processing methods, and methods of forming capacitor constructions

Semiconductor processing methods, and methods of forming capacitor constructions

Method for removing metal layers formed outside an aperture of a BPSG layer utilizing multiple etching processes including electrochemical-mechanical polishing

FUCSKO JANOS

Single crystal silicon structures

LEE WHONCHEE

Methods and apparatuses for electrochemical-mechanical polishing