Inventor
FUCSKO JANOS
US44 patents
⚠️ This page may combine multiple inventors who share the name “FUCSKO JANOS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
30 patentsUS7521378B2Apr 21, 2009
Low temperature process for polysilazane oxidation/densification
MICRON TECHNOLOGY INC173 citations99
US7030034B2Apr 18, 2006
Methods of etching silicon nitride substantially selectively relative to an oxide of aluminum
MICRON TECHNOLOGY INC234 citations99
US7709341B2May 4, 2010
Methods of shaping vertical single crystal silicon walls and resulting structures
MICRON TECHNOLOGY INC44 citations96
US7628932B2Dec 8, 2009
Wet etch suitable for creating square cuts in si
MICRON TECHNOLOGY INC45 citations96
US7557420B2Jul 7, 2009
Low temperature process for polysilazane oxidation/densification
MICRON TECHNOLOGY INC25 citations92
US7439157B2Oct 21, 2008
Isolation trenches for memory devices
MICRON TECHNOLOGY INC24 citations92
US7166539B2Jan 23, 2007
Wet etching method of removing silicon from a substrate
MICRON TECHNOLOGY INC16 citations92
US7973388B2Jul 5, 2011
Semiconductor structures including square cuts in single crystal silicon
MICRON TECHNOLOGY INC7 citations84
US7935602B2May 3, 2011
Semiconductor processing methods
MICRON TECHNOLOGY INC15 citations84
US7273796B2Sep 25, 2007
Methods of forming trench isolation in the fabrication of integrated circuitry and methods of fabricating integrated circuitry
MICRON TECHNOLOGY INC11 citations84
US7316981B2Jan 8, 2008
Method of removing silicon from a substrate
MICRON TECHNOLOGY INC10 citations83
US8669144B2Mar 11, 2014
Methods of forming memory arrays
MICRON TECHNOLOGY INC1 citations63
US7892942B2Feb 22, 2011
Methods of forming semiconductor constructions, and methods of forming isolation regions
MICRON TECHNOLOGY INC2 citations63
US7205245B2Apr 17, 2007
Method of forming trench isolation within a semiconductor substrate
MICRON TECHNOLOGY INC2 citations63
US11626481B2Apr 11, 2023
Semiconductor constructions, memory arrays, electronic systems, and methods of forming semiconductor constructions
MICRON TECHNOLOGY INC0 citations62
US11171205B2Nov 9, 2021
Semiconductor constructions, memory arrays, electronic systems, and methods of forming semiconductor constructions
MICRON TECHNOLOGY INC0 citations62
US9929233B2Mar 27, 2018
Memory arrays
MICRON TECHNOLOGY INC1 citations62
US7772672B2Aug 10, 2010
Semiconductor constructions
MICRON TECHNOLOGY INC1 citations62
US7135381B2Nov 14, 2006
Wet etching method of removing silicon from a substrate and method of forming trench isolation
MICRON TECHNOLOGY INC2 citations62
US6790786B2Sep 14, 2004
Etching processes for integrated circuit manufacturing including methods of forming capacitors
MICRON TECHNOLOGY INC4 citations61
US7629266B2Dec 8, 2009
Etch compositions and methods of processing a substrate
MICRON TECHNOLOGY INC1 citations60
US7491650B2Feb 17, 2009
Etch compositions and methods of processing a substrate
MICRON TECHNOLOGY INC3 citations60
US11404267B2Aug 2, 2022
Semiconductor structure formation
MICRON TECHNOLOGY INC0 citations56
US10622442B2Apr 14, 2020
Electronic systems and methods of forming semiconductor constructions
MICRON TECHNOLOGY INC0 citations52
US10170545B2Jan 1, 2019
Memory arrays
MICRON TECHNOLOGY INC0 citations52
US9559163B2Jan 31, 2017
Memory arrays
MICRON TECHNOLOGY INC0 citations52
US7713885B2May 11, 2010
Methods of etching oxide, reducing roughness, and forming capacitor constructions
MICRON TECHNOLOGY INC0 citations52
US7811897B2Oct 12, 2010
Method of forming trench isolation
MICRON TECHNOLOGY INC0 citations51
US8969217B2Mar 3, 2015
Methods of treating semiconductor substrates, methods of forming openings during semiconductor fabrication, and methods of removing particles from over semiconductor substrates
MICRON TECHNOLOGY INC0 citations49
US7699998B2Apr 20, 2010
Method of substantially uniformly etching non-homogeneous substrates
MICRON TECHNOLOGY INC0 citations46
FUCSKO JANOS
4 patentsUS8575040B2Nov 5, 2013
Low temperature process for polysilazane oxidation/densification
FUCSKO JANOS18 citations91
US8159050B2Apr 17, 2012
Single crystal silicon structures
FUCSKO JANOS9 citations83
US9040424B2May 26, 2015
Methods of forming single crystal silicon structures and semiconductor device structures including single crystal silicon structures
FUCSKO JANOS0 citations51
US8492288B2Jul 23, 2013
Methods of treating semiconductor substrates, methods of forming openings during semiconductor fabrication, and methods of removing particles from over semiconductor substrates
FUCSKO JANOS0 citations48