Inventor
LIU HAO-JUIN
TW19 patents
⚠️ This page may combine multiple inventors who share the name “LIU HAO-JUIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
10 patentsUS9472521B2Oct 18, 2016
Scheme for connector site spacing and resulting structures
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9406629B2Aug 2, 2016
Semiconductor package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US11088102B2Aug 10, 2021
Bonded structures for package and substrate
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10468366B2Nov 5, 2019
Bonded structures for package and substrate
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US9741589B2Aug 22, 2017
Substrate pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9673125B2Jun 6, 2017
Interconnection structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9673161B2Jun 6, 2017
Bonded structures for package and substrate
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10037973B2Jul 31, 2018
Method for manufacturing semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10867810B2Dec 15, 2020
Substrate pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10748785B2Aug 18, 2020
Substrate pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
TAIWAN SEMICONDUCTOR MFG
5 patentsUS9117825B2Aug 25, 2015
Substrate pad structure
TAIWAN SEMICONDUCTOR MFG12 citations92
US8829673B2Sep 9, 2014
Bonded structures for package and substrate
TAIWAN SEMICONDUCTOR MFG17 citations92
US9397059B2Jul 19, 2016
Bonded structures for package and substrate
TAIWAN SEMICONDUCTOR MFG4 citations73
US9123788B2Sep 1, 2015
Bonded structures for package and substrate
TAIWAN SEMICONDUCTOR MFG1 citations62
US9040350B2May 26, 2015
Packaging and function tests for package-on-package and system-in-package structures
TAIWAN SEMICONDUCTOR MFG0 citations52