Inventor
HSU HUNG-WEI
TW10 patents
⚠️ This page may combine multiple inventors who share the name “HSU HUNG-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEXTRONICS ENGINEERING CORP
5 patentsUS9634432B2Apr 25, 2017
High frequency connector with enhanced grounding for reduced crosstalk
NEXTRONICS ENGINEERING CORP13 citations82
US9774143B1Sep 26, 2017
High frequency signal communication connector with improved crosstalk performance
NEXTRONICS ENGINEERING CORP11 citations78
US9520678B2Dec 13, 2016
Signal transmission connector
NEXTRONICS ENGINEERING CORP5 citations68
US10074941B1Sep 11, 2018
High-speed connector and connector assembly
NEXTRONICS ENGINEERING CORP6 citations67
US9323016B2Apr 26, 2016
Bi-directional data transmission method, high-frequency connector and optical connector using the same
NEXTRONICS ENGINEERING CORP1 citations50
CO TECH DEV CORP
5 patentsUS12120816B2Oct 15, 2024
Micro-roughened electrodeposited copper foil and copper clad laminate
CO TECH DEV CORP1 citations68
US12557213B2Feb 17, 2026
Micro-roughened electrodeposited copper foil and copper clad laminate
CO TECH DEV CORP0 citations57
US11655555B2May 23, 2023
Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same
CO TECH DEV CORP0 citations57
US11408087B2Aug 9, 2022
Advanced electrodeposited copper foil having island-shaped microstructures and copper clad laminate using the same
CO TECH DEV CORP0 citations57
US11332839B2May 17, 2022
Advanced electrodeposited copper foil and copper clad laminate using the same
CO TECH DEV CORP0 citations57