P

Inventor

ZHANG XIAONAN

US41 patents
⚠️ This page may combine multiple inventors who share the name “ZHANG XIAONAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

QUALCOMM INC

18 patents
US9263186B2Feb 16, 2016

DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor

QUALCOMM INC38 citations92
US9368566B2Jun 14, 2016

Package on package (PoP) integrated device comprising a capacitor in a substrate

QUALCOMM INC7 citations84
US9247647B1Jan 26, 2016

High quality factor inductor and high quality factor filter in package substrate or printed circuit board (PCB)

QUALCOMM INC16 citations84
US9812752B2Nov 7, 2017

Flip-chip employing integrated cavity filter, and related components, systems, and methods

QUALCOMM INC6 citations82
US9443810B1Sep 13, 2016

Flip-chip employing integrated cavity filter, and related components, systems, and methods

QUALCOMM INC6 citations82
US9691694B2Jun 27, 2017

Substrate comprising stacks of interconnects, interconnect on solder resist layer and interconnect on side portion of substrate

QUALCOMM INC3 citations73
US9576718B2Feb 21, 2017

Inductor structure in a semiconductor device

QUALCOMM INC2 citations72
US9035421B2May 19, 2015

High quality factor inductor implemented in wafer level packaging (WLP)

QUALCOMM INC5 citations71
US8356263B1Jan 15, 2013

Yield based flop hold time and setup time definition

QUALCOMM INC2 citations60
US10109584B2Oct 23, 2018

Patterned grounds and methods of forming the same

QUALCOMM INC0 citations52
US9806144B2Oct 31, 2017

Solenoid inductor in a substrate

QUALCOMM INC1 citations52
US9653533B2May 16, 2017

Multi-layer interconnected spiral capacitor

QUALCOMM INC1 citations52
US9373583B2Jun 21, 2016

High quality factor filter implemented in wafer level packaging (WLP) integrated device

QUALCOMM INC0 citations52
US9362218B2Jun 7, 2016

Integrated passive device (IPD) on substrate

QUALCOMM INC0 citations52
US9324779B2Apr 26, 2016

Toroid inductor in an integrated device

QUALCOMM INC0 citations52
US9245940B2Jan 26, 2016

Inductor design on floating UBM balls for wafer level package (WLP)

QUALCOMM INC1 citations51
US10051741B2Aug 14, 2018

Embedded layered inductor

QUALCOMM INC0 citations41
US9449762B2Sep 20, 2016

Embedded package substrate capacitor with configurable/controllable equivalent series resistance

QUALCOMM INC0 citations41

VERISILICON HOLDINGS CO LTD

3 patents

COLGATE PALMOLIVE CO

3 patents

UNISYS CORP

3 patents

GOOGLE INC

2 patents

UNIV HONG KONG SCIENCE & TECH

2 patents

SHENGLI OILFIELD SHENGJI PETROLEUM EQUIPMENT CO LTD

2 patents

METAFLOW TECHNOLOGIES INC

1 patent

DATTA ANIMESH

1 patent

VERI SILICON HOLDINGS CO LTD

1 patent

MEDIATEK SINGAPORE PTE LTD

1 patent

BAI XIAOLIANG

1 patent

ACOUSTIC METAMATERIALS COMPANY LTD

1 patent

VIVO MOBILE COMMUNICATION CO LTD

1 patent

GOOGLE LLC

1 patent