Inventor
ZHANG XIAONAN
US41 patents
⚠️ This page may combine multiple inventors who share the name “ZHANG XIAONAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
18 patentsUS9263186B2Feb 16, 2016
DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor
QUALCOMM INC38 citations92
US9368566B2Jun 14, 2016
Package on package (PoP) integrated device comprising a capacitor in a substrate
QUALCOMM INC7 citations84
US9247647B1Jan 26, 2016
High quality factor inductor and high quality factor filter in package substrate or printed circuit board (PCB)
QUALCOMM INC16 citations84
US9812752B2Nov 7, 2017
Flip-chip employing integrated cavity filter, and related components, systems, and methods
QUALCOMM INC6 citations82
US9443810B1Sep 13, 2016
Flip-chip employing integrated cavity filter, and related components, systems, and methods
QUALCOMM INC6 citations82
US9691694B2Jun 27, 2017
Substrate comprising stacks of interconnects, interconnect on solder resist layer and interconnect on side portion of substrate
QUALCOMM INC3 citations73
US9576718B2Feb 21, 2017
Inductor structure in a semiconductor device
QUALCOMM INC2 citations72
US9035421B2May 19, 2015
High quality factor inductor implemented in wafer level packaging (WLP)
QUALCOMM INC5 citations71
US8356263B1Jan 15, 2013
Yield based flop hold time and setup time definition
QUALCOMM INC2 citations60
US10109584B2Oct 23, 2018
Patterned grounds and methods of forming the same
QUALCOMM INC0 citations52
US9806144B2Oct 31, 2017
Solenoid inductor in a substrate
QUALCOMM INC1 citations52
US9653533B2May 16, 2017
Multi-layer interconnected spiral capacitor
QUALCOMM INC1 citations52
US9373583B2Jun 21, 2016
High quality factor filter implemented in wafer level packaging (WLP) integrated device
QUALCOMM INC0 citations52
US9362218B2Jun 7, 2016
Integrated passive device (IPD) on substrate
QUALCOMM INC0 citations52
US9324779B2Apr 26, 2016
Toroid inductor in an integrated device
QUALCOMM INC0 citations52
US9245940B2Jan 26, 2016
Inductor design on floating UBM balls for wafer level package (WLP)
QUALCOMM INC1 citations51
US10051741B2Aug 14, 2018
Embedded layered inductor
QUALCOMM INC0 citations41
US9449762B2Sep 20, 2016
Embedded package substrate capacitor with configurable/controllable equivalent series resistance
QUALCOMM INC0 citations41
VERISILICON HOLDINGS CO LTD
3 patentsUS7185294B2Feb 27, 2007
Standard cell library having globally scalable transistor channel length
VERISILICON HOLDINGS CO LTD275 citations98
US7426710B2Sep 16, 2008
Standard cell library having cell drive strengths selected according to delay
VERISILICON HOLDINGS CO LTD198 citations95
US7254802B2Aug 7, 2007
Standard cell library having cell drive strengths selected according to delay
VERISILICON HOLDINGS CO LTD3 citations59