Inventor
SIDHU RAJEN S
US15 patents
⚠️ This page may combine multiple inventors who share the name “SIDHU RAJEN S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
9 patentsUS8896110B2Nov 25, 2014
Paste thermal interface materials
INTEL CORP30 citations91
US8809181B2Aug 19, 2014
Multi-solder techniques and configurations for integrated circuit package assembly
INTEL CORP7 citations82
US10651108B2May 12, 2020
Foam composite
INTEL CORP4 citations71
US9257405B2Feb 9, 2016
Multi-solder techniques and configurations for integrated circuit package assembly
INTEL CORP3 citations71
US9461014B2Oct 4, 2016
Methods of forming ultra thin package structures including low temperature solder and structures formed therby
INTEL CORP2 citations62
US9394619B2Jul 19, 2016
Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby
INTEL CORP0 citations51
US9064971B2Jun 23, 2015
Methods of forming ultra thin package structures including low temperature solder and structures formed therby
INTEL CORP1 citations51
US10049971B2Aug 14, 2018
Package structure to enhance yield of TMI interconnections
INTEL CORP0 citations48
US9283641B2Mar 15, 2016
Flux materials for heated solder placement and associated techniques and configurations
INTEL CORP0 citations40
SIDHU RAJEN S
3 patentsUS8701281B2Apr 22, 2014
Substrate metallization and ball attach metallurgy with a novel dopant element
SIDHU RAJEN S11 citations81
US9024453B2May 5, 2015
Functional material systems and processes for package-level interconnects
SIDHU RAJEN S1 citations48
US9950393B2Apr 24, 2018
Hybrid low metal loading flux
SIDHU RAJEN S0 citations46