Inventor

DUDEK MARTHA A

US6 patents

⚠️ This page may combine multiple inventors who share the name “DUDEK MARTHA A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

3 patents

US8809181B2Aug 19, 2014

Multi-solder techniques and configurations for integrated circuit package assembly

INTEL CORP7 citations82

US9257405B2Feb 9, 2016

Multi-solder techniques and configurations for integrated circuit package assembly

INTEL CORP3 citations71

US9283641B2Mar 15, 2016

Flux materials for heated solder placement and associated techniques and configurations

INTEL CORP0 citations40

SIDHU RAJEN S

2 patents

US9024453B2May 5, 2015

Functional material systems and processes for package-level interconnects

SIDHU RAJEN S1 citations48

US9950393B2Apr 24, 2018

Hybrid low metal loading flux

SIDHU RAJEN S0 citations46

JIANG HONGJIN

1 patent

US8920934B2Dec 30, 2014

Hybrid solder and filled paste in microelectronic packaging

JIANG HONGJIN17 citations76