Inventor
OHKUBO HIRONARI
JP11 patents
⚠️ This page may combine multiple inventors who share the name “OHKUBO HIRONARI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
10 patentsUS9724783B2Aug 8, 2017
Laser processing apparatus
DISCO CORP10 citations80
US9870961B2Jan 16, 2018
Wafer processing method
DISCO CORP5 citations69
US10668569B2Jun 2, 2020
Laser processing apparatus
DISCO CORP1 citations56
US12236619B2Feb 25, 2025
Processing apparatus
DISCO CORP0 citations49
US12296402B2May 13, 2025
Laser processing apparatus
DISCO CORP0 citations48
US11462439B2Oct 4, 2022
Wafer processing method
DISCO CORP0 citations46
US11476137B2Oct 18, 2022
Dividing apparatus including an imaging unit for detecting defects in a workplace
DISCO CORP0 citations40
US10211104B2Feb 19, 2019
Processing method of package wafer
DISCO CORP0 citations40
US10207362B2Feb 19, 2019
Laser processing apparatus
DISCO CORP0 citations36
US9779994B2Oct 3, 2017
Wafer processing method
DISCO CORP0 citations36