Inventor
MCPHERSON BRICE
US51 patents
⚠️ This page may combine multiple inventors who share the name “MCPHERSON BRICE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WOLFSPEED INC
24 patentsUSD954668SJun 14, 2022
Housing for a power module assembly
WOLFSPEED INC19 citations93
USD985517SMay 9, 2023
Power module having pin fins
WOLFSPEED INC5 citations84
US11696417B2Jul 4, 2023
High power multilayer module having low inductance and fast switching for paralleling power devices
WOLFSPEED INC4 citations74
US12224218B2Feb 11, 2025
Semiconductor packages with increased power handling
WOLFSPEED INC4 citations72
USD1041429SSep 10, 2024
Power module having pin fins
WOLFSPEED INC1 citations72
USD1036395SJul 23, 2024
Power module
WOLFSPEED INC2 citations72
US11887953B2Jan 30, 2024
Package for power electronics
WOLFSPEED INC2 citations72
US11756910B2Sep 12, 2023
Package for power electronics
WOLFSPEED INC2 citations72
US11721617B2Aug 8, 2023
Power module
WOLFSPEED INC2 citations69
US12446180B2Oct 14, 2025
High power multilayer module having low inductance and fast switching for paralleling power devices
WOLFSPEED INC0 citations62
US12400986B2Aug 26, 2025
Package for power electronics
WOLFSPEED INC0 citations62
USD1081603SJul 1, 2025
Power module
WOLFSPEED INC0 citations62
US11445630B2Sep 13, 2022
High power multilayer module having low inductance and fast switching for paralleling power devices
WOLFSPEED INC1 citations62
US12159909B2Dec 3, 2024
Power semiconductor device with reduced strain
WOLFSPEED INC0 citations61
US11869948B2Jan 9, 2024
Power semiconductor device with reduced strain
WOLFSPEED INC0 citations61
USD1073632SMay 6, 2025
Power module
WOLFSPEED INC1 citations60
USD1056862SJan 7, 2025
Semiconductor package
WOLFSPEED INC0 citations60
US11984433B2May 14, 2024
Arrangements of power semiconductor devices for improved thermal performance
WOLFSPEED INC0 citations60
US12199071B2Jan 14, 2025
Compact power module
WOLFSPEED INC0 citations59
US12150258B2Nov 19, 2024
Dual inline power module
WOLFSPEED INC1 citations59
US12080635B2Sep 3, 2024
Power module
WOLFSPEED INC0 citations59
US11923344B2Mar 5, 2024
Compact power module
WOLFSPEED INC0 citations59
US12374660B2Jul 29, 2025
Power module
WOLFSPEED INC0 citations52
US11735488B2Aug 22, 2023
Power module
WOLFSPEED INC0 citations52
CREE FAYETTEVILLE INC
15 patentsUSD903590SDec 1, 2020
Power module
CREE FAYETTEVILLE INC15 citations93
US10917992B2Feb 9, 2021
High power multilayer module having low inductance and fast switching for paralleling power devices
CREE FAYETTEVILLE INC14 citations85
USD942403SFeb 1, 2022
Power module having pin fins
CREE FAYETTEVILLE INC7 citations84
US11069640B2Jul 20, 2021
Package for power electronics
CREE FAYETTEVILLE INC9 citations84
US10749443B2Aug 18, 2020
High power multilayer module having low inductance and fast switching for paralleling power devices
CREE FAYETTEVILLE INC10 citations84
USD969740SNov 15, 2022
Power module
CREE FAYETTEVILLE INC5 citations83
US10212838B2Feb 19, 2019
High power multilayer module having low inductance and fast switching for paralleling power devices
CREE FAYETTEVILLE INC6 citations83
US10080301B2Sep 18, 2018
High voltage power chip module
CREE FAYETTEVILLE INC8 citations83
US10405450B2Sep 3, 2019
High power multilayer module having low inductance and fast switching for paralleling power devices
CREE FAYETTEVILLE INC7 citations82
USD954667SJun 14, 2022
Power module
CREE FAYETTEVILLE INC3 citations72
US10784235B2Sep 22, 2020
Silicon carbide power module
CREE FAYETTEVILLE INC4 citations71
US10136529B2Nov 20, 2018
Low profile, highly configurable, current sharing paralleled wide band gap power device power module
CREE FAYETTEVILLE INC3 citations69
US12010823B2Jun 11, 2024
High power multilayer module having low inductance and fast switching for paralleling power devices
CREE FAYETTEVILLE INC0 citations62
US11135669B2Oct 5, 2021
Method and device for a high temperature vacuum-safe solder resist utilizing laser ablation of solderable surfaces for an electronic module assembly
CREE FAYETTEVILLE INC0 citations60
USD909310SFeb 2, 2021
Power module
CREE FAYETTEVILLE INC0 citations60
MITCHELL DAVID J
6 patentsUS8629783B2Jan 14, 2014
Wireless telemetry electronic circuitry for measuring strain in high-temperature environments
MITCHELL DAVID J9 citations83
US8458899B2Jun 11, 2013
Method for manufacturing a circuit for high temperature and high g-force environments
MITCHELL DAVID J5 citations83
US8220990B2Jul 17, 2012
Wireless telemetry electronic circuit package for high temperature environments
MITCHELL DAVID J9 citations83
US8223036B2Jul 17, 2012
Wireless telemetry electronic circuitry for measuring strain in high-temperature environments
MITCHELL DAVID J14 citations83
US8092080B2Jan 10, 2012
Wireless telemetry circuit structure for measuring temperature in high temperature environments
MITCHELL DAVID J17 citations83
US8525036B2Sep 3, 2013
Wireless telemetry electronic circuit board for high temperature environments
MITCHELL DAVID J4 citations62
ARKANSAS POWER ELECTRONICS INT INC
4 patentsUS9426883B2Aug 23, 2016
Low profile, highly configurable, current sharing paralleled wide band gap power device power module
ARKANSAS POWER ELECTRONICS INT INC21 citations88
US9275938B1Mar 1, 2016
Low profile high temperature double sided flip chip power packaging
ARKANSAS POWER ELECTRONICS INT INC13 citations83
US9095054B1Jul 28, 2015
High temperature equalized electrical parasitic power packaging method for many paralleled semiconductor power devices
ARKANSAS POWER ELECTRONICS INT INC19 citations80
US9967977B1May 8, 2018
Step etched metal electrical contacts
ARKANSAS POWER ELECTRONICS INT INC5 citations73
SIEMENS ENERGY INC
1 patentShowing the top 50 of 51 patents by PatentIndex Score.