Inventor
PASSMORE BRANDON
US17 patents
⚠️ This page may combine multiple inventors who share the name “PASSMORE BRANDON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CREE FAYETTEVILLE INC
8 patentsUSD908632SJan 26, 2021
Power module
CREE FAYETTEVILLE INC10 citations84
US10448524B2Oct 15, 2019
High voltage power module
CREE FAYETTEVILLE INC6 citations83
US10080301B2Sep 18, 2018
High voltage power chip module
CREE FAYETTEVILLE INC8 citations83
US10750627B2Aug 18, 2020
High voltage power module
CREE FAYETTEVILLE INC1 citations72
US10784235B2Sep 22, 2020
Silicon carbide power module
CREE FAYETTEVILLE INC4 citations71
US10136529B2Nov 20, 2018
Low profile, highly configurable, current sharing paralleled wide band gap power device power module
CREE FAYETTEVILLE INC3 citations69
US11206740B2Dec 21, 2021
High voltage power module
CREE FAYETTEVILLE INC0 citations61
USD909310SFeb 2, 2021
Power module
CREE FAYETTEVILLE INC0 citations60
WOLFSPEED INC
4 patentsUS11721617B2Aug 8, 2023
Power module
WOLFSPEED INC2 citations69
USD1073632SMay 6, 2025
Power module
WOLFSPEED INC1 citations60
US11984433B2May 14, 2024
Arrangements of power semiconductor devices for improved thermal performance
WOLFSPEED INC0 citations60
US12080635B2Sep 3, 2024
Power module
WOLFSPEED INC0 citations59
ARKANSAS POWER ELECTRONICS INT INC
3 patentsUS9407251B1Aug 2, 2016
Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration
ARKANSAS POWER ELECTRONICS INT INC29 citations90
US9426883B2Aug 23, 2016
Low profile, highly configurable, current sharing paralleled wide band gap power device power module
ARKANSAS POWER ELECTRONICS INT INC21 citations88
US9275938B1Mar 1, 2016
Low profile high temperature double sided flip chip power packaging
ARKANSAS POWER ELECTRONICS INT INC13 citations83