Inventor
YUMOTO RYOHEI
JP8 patents
Patents
8 patentsUS11302602B2Apr 12, 2022
Power-module substrate with heat-sink
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US11908768B2Feb 20, 2024
Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board
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US11289400B2Mar 29, 2022
Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board
MITSUBISHI MATERIALS CORP0 citations61
US11289390B2Mar 29, 2022
Insulation circuit board with heat sink
MITSUBISHI MATERIALS CORP0 citations61
US12356554B2Jul 8, 2025
Method for manufacturing bonded body and method for manufacturing insulation circuit substrate
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US11322424B2May 3, 2022
Insulation circuit board with heat sink
MITSUBISHI MATERIALS CORP0 citations50
US11013107B2May 18, 2021
Insulated circuit board
MITSUBISHI MATERIALS CORP0 citations50
US11462456B2Oct 4, 2022
Power-module substrate with heat-sink
MITSUBISHI MATERIALS CORP0 citations49