Inventor
LU CHANG-LUN
TW16 patents
⚠️ This page may combine multiple inventors who share the name “LU CHANG-LUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
15 patentsUS9515039B2Dec 6, 2016
Substrate structure with first and second conductive bumps having different widths
SILICONWARE PRECISION INDUSTRIES CO LTD8 citations83
US9601403B2Mar 21, 2017
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations72
US9818635B2Nov 14, 2017
Carrier structure, packaging substrate, electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations71
US10796970B2Oct 6, 2020
Method for fabricating electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations61
US9263380B2Feb 16, 2016
Semiconductor interposer and package structure having the same
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations52
US10461002B2Oct 29, 2019
Fabrication method of electronic module
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9735075B2Aug 15, 2017
Electronic module and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US10403570B2Sep 3, 2019
Method for fabricating electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US10211082B2Feb 19, 2019
Fabrication method of electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US10141233B2Nov 27, 2018
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations50
US10128178B2Nov 13, 2018
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations50
US9831191B2Nov 28, 2017
Electronic package, semiconductor substrate of the electronic package, and method for manufacturing the electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US9899309B2Feb 20, 2018
Electronic package and semiconductor substrate
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48
US10201086B2Feb 5, 2019
Electronic device
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations45
US10242972B2Mar 26, 2019
Package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations41