Inventor
TSAI WEN-JUNG
TW24 patents
⚠️ This page may combine multiple inventors who share the name “TSAI WEN-JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
22 patentsUS11195808B2Dec 7, 2021
Electronic package having antenna function and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD5 citations83
US12068535B2Aug 20, 2024
Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations73
US11594501B2Feb 28, 2023
Fabrication method of electronic package having antenna function
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations72
US9907186B1Feb 27, 2018
Electronic package structure and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD6 citations68
US12224255B2Feb 11, 2025
Electronic package including lead frame having multiple conductive posts
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US11973043B2Apr 30, 2024
Multiple conductive posts
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US11233324B2Jan 25, 2022
Packaging structure and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US10833394B2Nov 10, 2020
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations62
US12438266B2Oct 7, 2025
Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12057409B2Aug 6, 2024
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations60
US12100641B2Sep 24, 2024
Electronic package and method for manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US11749583B2Sep 5, 2023
Electronic package and method for manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US11114393B2Sep 7, 2021
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US12211776B2Jan 28, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations58
US11532568B2Dec 20, 2022
Electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations57
US12532745B2Jan 20, 2026
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations55
US11271313B2Mar 8, 2022
Electronic package and method for manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations53
US12500131B2Dec 16, 2025
Electronic package including an interposer stacked on an electronic element and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US12476229B2Nov 18, 2025
Electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US12500181B2Dec 16, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US12388062B2Aug 12, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations47
US10431535B2Oct 1, 2019
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations46