Inventor

KE CHUN-CHI

TW42 patents

⚠️ This page may combine multiple inventors who share the name “KE CHUN-CHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KE CHUN-CHI

SILICONWARE PRECISION INDUSTRIES CO LTD

Package structure fabrication method

Method for making a semiconductor package

Semiconductor device and fabrication method thereof

Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function

Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof

Circuit probing contact pad formed on a bond pad in a flip chip package

Fabrication method of a semiconductor device

Semiconductor device having conductive bumps and deviated solder pad

Semiconductor package having metal layer

Method for fabricating carrier-free semiconductor package

Electronic package and method for fabricating the same

Fabrication method of semiconductor package without chip carrier

Fabrication method of semiconductor package having electrical connecting structures

Fabrication method of package structure having MEMS element

Method for fabricating an encapsulated electronic package using a supporting plate

Flash-preventing semiconductor package

Semiconductor package and fabrication method thereof

Method for fabricating EMI shielding package structure

Fabrication method of semiconductor device having conductive bumps

Fabrication method of under bump metallurgy structure

Carrier-free semiconductor package and fabrication method

Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages

Package structure having MEMS element

Semiconductor package structure

Semiconductor package having electrical connecting structures and fabrication method thereof

CHAN CHANG-YUEH

Package structure having MEMS element and fabrication method thereof

Package structure having micro-electromechanical element and fabrication method thereof

Package structure having micro-electromechanical element

Package having MEMS element and fabrication method thereof

LIN PANG-CHUN

Fabrication method of semiconductor package structure

Semiconductor package structure

Semiconductor package having electrical connecting structures and fabrication method thereof

Package structure

CHIU CHI-HSIN

Fabrication method of package structure having MEMS element

Package structure having MEMS element

CHANG CHIANG-CHENG

Chip scale package with electronic component received in encapsulant, and fabrication method thereof

Chip scale package and fabrication method thereof

YAO CHIN-TSAI

EMI shielding package structure and method for fabricating the same

Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same

SILICONEWARE PREC IND CO LTD

Method of forming circuit probing contact points on fine pitch peripheral bond pads on flip chip

KE CHUN-CHI

Fabrication method of semiconductor device having conductive bumps

TSAI YUEH-YING

Semiconductor package without chip carrier and fabrication method thereof