Inventor
KAJIWARA RYOICHI
JP33 patents
⚠️ This page may combine multiple inventors who share the name “KAJIWARA RYOICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
13 patentsUS6798072B2Sep 28, 2004
Flip chip assembly structure for semiconductor device and method of assembling therefor
HITACHI LTD144 citations97
US5884835AMar 23, 1999
Ultrasonic bonding method and ultrasonic bonding apparatus
HITACHI LTD60 citations96
US5431324AJul 11, 1995
Ultrasonic bonding apparatus and quality monitoring method
HITACHI LTD69 citations93
US6569764B1May 27, 2003
Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material
HITACHI LTD43 citations92
US6784554B2Aug 31, 2004
Semiconductor device and manufacturing method thereof
HITACHI LTD49 citations91
US4996589AFeb 26, 1991
Semiconductor module and cooling device of the same
HITACHI LTD30 citations91
US4740866AApr 26, 1988
Sealed-type liquid cooling device with expandable bellow for semiconductor chips
HITACHI LTD52 citations90
US5323952AJun 28, 1994
Bonding apparatus and testing apparatus of a bonded portion
HITACHI LTD37 citations88
US7879455B2Feb 1, 2011
High-temperature solder, high-temperature solder paste and power semiconductor using same
HITACHI LTD14 citations83
US7608917B2Oct 27, 2009
Power semiconductor module
HITACHI LTD15 citations83
US4809058AFeb 28, 1989
Integrated circuit device
HITACHI LTD20 citations81
US4454408AJun 12, 1984
Method for controlling arc welding and apparatus therefor
HITACHI LTD6 citations73
US7964975B2Jun 21, 2011
Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them
HITACHI LTD1 citations51
KAJIWARA RYOICHI
7 patentsUS8183607B2May 22, 2012
Semiconductor device
KAJIWARA RYOICHI8 citations83
US8643185B2Feb 4, 2014
Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material
KAJIWARA RYOICHI13 citations82
US8314484B2Nov 20, 2012
Semiconductor device and method of manufacturing the same
KAJIWARA RYOICHI9 citations82
US8455986B2Jun 4, 2013
Mosfet package
KAJIWARA RYOICHI4 citations73
US8303854B2Nov 6, 2012
Sintering silver paste material and method for bonding semiconductor chip
KAJIWARA RYOICHI4 citations59
US8313983B2Nov 20, 2012
Fabrication method for resin-encapsulated semiconductor device
KAJIWARA RYOICHI0 citations51
US9209044B2Dec 8, 2015
Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part
KAJIWARA RYOICHI1 citations48
RENESAS ELECTRONICS CORP
5 patentsUS7985991B2Jul 26, 2011
MOSFET package
RENESAS ELECTRONICS CORP16 citations92
US7816780B2Oct 19, 2010
Semiconductor apparatus and manufacturing method of semiconductor apparatus
RENESAS ELECTRONICS CORP12 citations84
US8816411B2Aug 26, 2014
Mosfet package
RENESAS ELECTRONICS CORP3 citations72
US9177833B2Nov 3, 2015
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP3 citations59
US8492202B2Jul 23, 2013
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP1 citations51