Inventor

MORITA TOSHIAKI

JP79 patents

⚠️ This page may combine multiple inventors who share the name “MORITA TOSHIAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MORITA TOSHIAKI

SHIMA SEIKI MFG

Yarn carrier of weft knitting device

Sinker device of flat knitting machine

Apparatus for measuring a cutting blade width in a cutting apparatus

Needle selection device of flat knitting machine

Removable moving member for knitting and weft knitting machine provided with knitting member switching apparatus

Knitting method and system using stretch yarn

Composite needle of knitting machine

Guide mechanism of knitting member and compound needle assembling the guide mechanism therein

Compound needle of knitting machine

End yarn inserting device of flat knitting machine

Yarn feeding device for flat knitting machine

Needle selection device of flat knitting machine

Needle selection device of flat knitting machine

Method and apparatus for yarn processing position control of flat knitting machine

Stitch control device in flat knitting machine

HITACHI LTD

Flip chip assembly structure for semiconductor device and method of assembling therefor

Method for mounting an electronic part on a substrate using a liquid containing metal particles

Inverter and vehicle drive unit using the same

Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material member

Semiconductor device and manufacturing method thereof

Semiconductor device

Low temperature bonding material comprising metal particles and bonding method

Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device

Method of solder bonding and power semiconductor device manufactured by the method

Semiconductor device and power conversion apparatus using the same

RENESAS TECH CORP

Semiconductor device

Semiconductor device with joint structure having lead-free solder layer over nickel layer

MOSFET package

MOSFET package

MOSFET package

Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors

Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors

SHARP KK

Method for determining lines of character images for use in an optical reader

Translation method and apparatus using optical character reader

Method for determining coordinates of circumscribed rectangular frame of each character for use in optical character reader

Handwritten character recognition device

Optical character reader

OCR for reading a constraint free hand-written character or the like

Optical character recognition system

KAJIWARA RYOICHI

Semiconductor device

Mosfet package

DAINIPPON INK & CHEMICALS

Resin composition for powder coating

RENESAS ELECTRONICS CORP

MOSFET package

HITACHI ULSI SYS CO LTD

Semiconductor device with alternate bonding wire arrangement

NAKATA TOSHIHIKO

Scanning probe microscope and method of observing sample using the same

GROZ BECKERT KG

Compound needle with asymmetrically divided closing element

YASUDA YUUSUKE

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

SAKURA COLOR PROD CORP

Writing instrument

YASUDA YUSUKE

Bonding method and bonding material using metal particle

IDE EIICHI

Electronic member, electronic part and manufacturing method therefor