Inventor

MIRA ALI

US25 patents

⚠️ This page may combine multiple inventors who share the name “MIRA ALI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MIRA ALI

HEATSCAPE COM INC

Method of forming a combined vapor chamber and heat pipe assembly

Combined liquid cooling cold plate and vapor chamber

Flexible folded fin heatsink with straight and radial fin patterns

Combination heat pipe and heat sink

Flexible folded fin heatsink with straight and radial fin patterns

Heatsink for optical modules

Combined liquid cooling cold plate and vapor chamber

Liquid cooling cold plate with diamond cut pin fins

Heatsink with perpendicular vapor chamber

Configurable mounting hole structure for flush mount integration with vapor chamber forming plates

Heatsink with vapor chamber and pedestal

SILICON GRAPHICS INC

Processor-inclusive memory module

High performance spiral heat sink

High performance sinusoidal heat sink for heat removal from electronic equipment

Readily removable heat sink assembly

Processor-inclusive memory module

Heat sink with integral attachment mechanism

Processor-inclusive memory module

HEATSCAPE INC

Power heat sink with hybrid vapor chamber—heat pipe module

Power heat sink with imbedded fly cut heat pipes

U-shaped condenser heat sink for low profile modules

Inverted floating core heat sink

High performance high power tower heat sink

JUNIPER NETWORKS INC

Apparatus and method for directing airflow in three dimensions to cool system components

ALOUSI SINAN

Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members