P

Inventor

AGRAWAL AKASH

IN19 patents
⚠️ This page may combine multiple inventors who share the name “AGRAWAL AKASH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INVENSAS CORP

12 patents
US9824974B2Nov 21, 2017

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies

INVENSAS CORP54 citations98
US9728524B1Aug 8, 2017

Enhanced density assembly having microelectronic packages mounted at substantial angle to board

INVENSAS CORP7 citations84
US9548273B2Jan 17, 2017

Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies

INVENSAS CORP10 citations84
US10008469B2Jun 26, 2018

Wafer-level packaging using wire bond wires in place of a redistribution layer

INVENSAS CORP4 citations72
US9847238B2Dec 19, 2017

Fan-out wafer-level packaging using metal foil lamination

INVENSAS CORP3 citations72
US9543277B1Jan 10, 2017

Wafer level packages with mechanically decoupled fan-in and fan-out areas

INVENSAS CORP3 citations72
US10790222B2Sep 29, 2020

Bonding of laminates with electrical interconnects

INVENSAS CORP0 citations52
US10283445B2May 7, 2019

Bonding of laminates with electrical interconnects

INVENSAS CORP0 citations52
US9646946B2May 9, 2017

Fan-out wafer-level packaging using metal foil lamination

INVENSAS CORP1 citations51
US9502372B1Nov 22, 2016

Wafer-level packaging using wire bond wires in place of a redistribution layer

INVENSAS CORP0 citations51
US9859234B2Jan 2, 2018

Methods and structures to repair device warpage

INVENSAS CORP0 citations42
US10354945B2Jul 16, 2019

Multi-surface edge pads for vertical mount packages and methods of making package stacks

INVENSAS CORP0 citations41

STRYKER CORP

2 patents

EMC IP HOLDING CO LLC

1 patent

LINKEDIN CORP

1 patent

NUTANIX INC

1 patent

GOOGLE LLC

1 patent

APPLIED MATERIALS INC

1 patent