Inventor
BABA SUSUMU
US22 patents
⚠️ This page may combine multiple inventors who share the name “BABA SUSUMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI PAPER MILLS LTD
10 patentsUS4910129AMar 20, 1990
Silver halide photographic light sensitive material
MITSUBISHI PAPER MILLS LTD8 citations71
US4818676AApr 4, 1989
Silver halide photographic emulsion
MITSUBISHI PAPER MILLS LTD8 citations69
US5200296AApr 6, 1993
Image receiving material for silver complex diffusion transfer process
MITSUBISHI PAPER MILLS LTD8 citations68
US5102770AApr 7, 1992
Method for production of photosensitive material for diffusion transfer process
MITSUBISHI PAPER MILLS LTD3 citations63
US5057395AOct 15, 1991
Silver complex diffusion transfer process
MITSUBISHI PAPER MILLS LTD2 citations63
US4863843ASep 5, 1989
Silver halide photographic emulsion containing predominantly silver bromide
MITSUBISHI PAPER MILLS LTD3 citations56
US5049475ASep 17, 1991
Method for production of photosensitive material for diffusion transfer process
MITSUBISHI PAPER MILLS LTD1 citations52
US5041354AAug 20, 1991
Photosensitive material for transfer process
MITSUBISHI PAPER MILLS LTD1 citations52
US5202219AApr 13, 1993
Image receiving material for silver complex diffusion transfer with uppermost layer
MITSUBISHI PAPER MILLS LTD0 citations47
US5660972AAug 26, 1997
Method for photographic development using a filter to inhibit occurrence of silver sludges
MITSUBISHI PAPER MILLS LTD0 citations44
BABA SUSUMU
3 patentsUS8471371B2Jun 25, 2013
Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device
BABA SUSUMU3 citations60
US8796832B2Aug 5, 2014
Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device
BABA SUSUMU0 citations50
US8148804B2Apr 3, 2012
Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device
BABA SUSUMU0 citations50
SEKISUI CHEMICAL CO LTD
3 patentsUS12139576B2Nov 12, 2024
Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board
SEKISUI CHEMICAL CO LTD0 citations59
US11873398B2Jan 16, 2024
Interlayer insulating material and multilayer printed wiring board
SEKISUI CHEMICAL CO LTD0 citations51
US10767051B2Sep 8, 2020
Cured body and multilayered substrate
SEKISUI CHEMICAL CO LTD0 citations51