Inventor

GRUNWALD JOHN J

US18 patents

⚠️ This page may combine multiple inventors who share the name “GRUNWALD JOHN J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GRUNWALD JOHN J

MACDERMID INC

Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions

Direct imaging process for forming resist pattern on a surface and use thereof in fabricating printing plates

Oxidizing accelerator

Electroless copper deposition solution using a hypophosphite reducing agent

Electroless copper composition solution using a hypophosphite reducing agent

Mechanical plating with oxidation-prone metals

Thermally stabilized photoresist images

Process of preparing thermoset resin substrates to improve adherence of electrolessly plated metal deposits

Additive printed circuit boards and method of manufacture

Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon

Method for the manufacture of printed circuit boards

Mechanical plating with oxidation-prone metals

Thermally stabilized photoresist images

Method of making metal-plastic laminates

Mechanical galvanizing coating resistant to chipping, flaking and cracking

Mechanical galvanizing coating resistant to chipping, flaking and, cracking

MORTON INT INC

Deep UV sensitive photoresist resistant to latent image decay

(unassigned)

Direct imaging process for forming resist pattern on a surface and use thereof in fabricating printing plates