Inventor
URASAKI NAOYUKI
JP28 patents
⚠️ This page may combine multiple inventors who share the name “URASAKI NAOYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
14 patentsUS6281450B1Aug 28, 2001
Substrate for mounting semiconductor chips
HITACHI CHEMICAL CO LTD206 citations97
US5689879ANov 25, 1997
Metal foil for printed wiring board and production thereof
HITACHI CHEMICAL CO LTD46 citations96
US5638598AJun 17, 1997
Process for producing a printed wiring board
HITACHI CHEMICAL CO LTD38 citations92
US5403672AApr 4, 1995
Metal foil for printed wiring board and production thereof
HITACHI CHEMICAL CO LTD33 citations92
US6197149B1Mar 6, 2001
Production of insulating varnishes and multilayer printed circuit boards using these varnishes
HITACHI CHEMICAL CO LTD15 citations84
US10326063B2Jun 18, 2019
Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
HITACHI CHEMICAL CO LTD7 citations83
US10205072B2Feb 12, 2019
Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
HITACHI CHEMICAL CO LTD5 citations83
US5444189AAug 22, 1995
Printed wiring board and production thereof
HITACHI CHEMICAL CO LTD19 citations81
US8343616B2Jan 1, 2013
Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device
HITACHI CHEMICAL CO LTD4 citations72
US9660156B2May 23, 2017
Optical semiconductor element mounting package, and optical semiconductor device using the same
HITACHI CHEMICAL CO LTD0 citations51
US9076932B2Jul 7, 2015
Optical semiconductor element mounting package, and optical semiconductor device using the same
HITACHI CHEMICAL CO LTD0 citations51
US9067906B2Jun 30, 2015
Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
HITACHI CHEMICAL CO LTD0 citations51
US8367153B2Feb 5, 2013
Method of using white resin in an electronic device
HITACHI CHEMICAL CO LTD0 citations51
US10381533B2Aug 13, 2019
Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflection
HITACHI CHEMICAL CO LTD0 citations50
SHENZHEN JUFEI OPTOELECTRONICS CO LTD
5 patentsUS10950767B2Mar 16, 2021
Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same
SHENZHEN JUFEI OPTOELECTRONICS CO LTD6 citations82
US12426415B2Sep 23, 2025
Method of manufacturing an optical semiconductor device
SHENZHEN JUFEI OPTOELECTRONICS CO LTD0 citations61
US12317657B2May 27, 2025
Optical semiconductor element mounting package and optical semiconductor device using the same
SHENZHEN JUFEI OPTOELECTRONICS CO LTD0 citations61
US11984545B2May 14, 2024
Method of manufacturing a light emitting device
SHENZHEN JUFEI OPTOELECTRONICS CO LTD0 citations61
US11810778B2Nov 7, 2023
Optical semiconductor element mounting package and optical semiconductor device using the same
SHENZHEN JUFEI OPTOELECTRONICS CO LTD0 citations61
KOTANI HAYATO
5 patentsUS8785525B2Jul 22, 2014
Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device
KOTANI HAYATO7 citations82
US8212271B2Jul 3, 2012
Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optical semiconductor device, and manufacturing method thereof
KOTANI HAYATO11 citations82
US8585272B2Nov 19, 2013
Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
KOTANI HAYATO6 citations71
US9387608B2Jul 12, 2016
Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition
KOTANI HAYATO2 citations60
US8637593B2Jan 28, 2014
Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
KOTANI HAYATO0 citations51
URASAKI NAOYUKI
3 patentsUS9673362B2Jun 6, 2017
Optical semiconductor element mounting package, and optical semiconductor device using the same
URASAKI NAOYUKI5 citations82
US9608184B2Mar 28, 2017
Optical semiconductor element mounting package, and optical semiconductor device using the same
URASAKI NAOYUKI1 citations60
US8421113B2Apr 16, 2013
Electronic device incorporating the white resin
URASAKI NAOYUKI0 citations49