Inventor
KIDA AKINARI
JP9 patents
Patents
9 patentsUS6268648B1Jul 31, 2001
Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device
HITACHI CHEMICAL CO LTD83 citations96
US5689879ANov 25, 1997
Metal foil for printed wiring board and production thereof
HITACHI CHEMICAL CO LTD46 citations96
US5690837ANov 25, 1997
Process for producing multilayer printed circuit board
HITACHI CHEMICAL CO LTD55 citations95
US5638598AJun 17, 1997
Process for producing a printed wiring board
HITACHI CHEMICAL CO LTD38 citations92
US5403672AApr 4, 1995
Metal foil for printed wiring board and production thereof
HITACHI CHEMICAL CO LTD33 citations92
US6492203B1Dec 10, 2002
Semiconductor device and method of fabrication thereof
HITACHI CHEMICAL CO LTD30 citations91
US4830691AMay 16, 1989
Process for producing high-density wiring board
HITACHI CHEMICAL CO LTD52 citations89
US5444189AAug 22, 1995
Printed wiring board and production thereof
HITACHI CHEMICAL CO LTD19 citations81
US5885723AMar 23, 1999
Bonding film for printed circuit boards
HITACHI CHEMICAL CO LTD12 citations71