Inventor
TIETZ JAMES V
US26 patents
⚠️ This page may combine multiple inventors who share the name “TIETZ JAMES V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
17 patentsUS6090210AJul 18, 2000
Multi-zone gas flow control in a process chamber
APPLIED MATERIALS INC234 citations99
US5879128AMar 9, 1999
Lift pin and support pin apparatus for a processing chamber
APPLIED MATERIALS INC607 citations99
US5781693AJul 14, 1998
Gas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetween
APPLIED MATERIALS INC909 citations99
US6135859AOct 24, 2000
Chemical mechanical polishing with a polishing sheet and a support sheet
APPLIED MATERIALS INC95 citations98
US6413873B1Jul 2, 2002
System for chemical mechanical planarization
APPLIED MATERIALS INC85 citations97
US5960555AOct 5, 1999
Method and apparatus for purging the back side of a substrate during chemical vapor processing
APPLIED MATERIALS INC92 citations97
US6302767B1Oct 16, 2001
Chemical mechanical polishing with a polishing sheet and a support sheet
APPLIED MATERIALS INC44 citations96
US6157106ADec 5, 2000
Magnetically-levitated rotor system for an RTP chamber
APPLIED MATERIALS INC79 citations96
US5848889ADec 15, 1998
Semiconductor wafer support with graded thermal mass
APPLIED MATERIALS INC74 citations96
US6133152AOct 17, 2000
Co-rotating edge ring extension for use in a semiconductor processing chamber
APPLIED MATERIALS INC43 citations92
US6123766ASep 26, 2000
Method and apparatus for achieving temperature uniformity of a substrate
APPLIED MATERIALS INC37 citations92
US6035100AMar 7, 2000
Reflector cover for a semiconductor processing chamber
APPLIED MATERIALS INC25 citations92
US5920797AJul 6, 1999
Method for gaseous substrate support
APPLIED MATERIALS INC25 citations92
US5884412AMar 23, 1999
Method and apparatus for purging the back side of a substrate during chemical vapor processing
APPLIED MATERIALS INC49 citations92
US7014538B2Mar 21, 2006
Article for polishing semiconductor substrates
APPLIED MATERIALS INC27 citations90
US6273794B1Aug 14, 2001
Apparatus and method for grinding a semiconductor wafer surface
APPLIED MATERIALS INC8 citations74
US6132295AOct 17, 2000
Apparatus and method for grinding a semiconductor wafer surface
APPLIED MATERIALS INC15 citations74
LAM RES CORP
7 patentsUS6916746B1Jul 12, 2005
Method for plasma etching using periodic modulation of gas chemistry
LAM RES CORP77 citations98
US7881886B1Feb 1, 2011
Methods for performing transient flow prediction and verification using discharge coefficients
LAM RES CORP26 citations92
US7294580B2Nov 13, 2007
Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon addition
LAM RES CORP29 citations92
US7822570B2Oct 26, 2010
Methods for performing actual flow verification
LAM RES CORP8 citations83
US7166535B2Jan 23, 2007
Plasma etching of silicon carbide
LAM RES CORP11 citations83
US9234775B2Jan 12, 2016
Methods for verifying gas flow rates from a gas supply system into a plasma processing chamber
LAM RES CORP6 citations72
US7311852B2Dec 25, 2007
Method of plasma etching low-k dielectric materials
LAM RES CORP6 citations60