Inventor
BROUILLETTE GUY P
CA3 patents
Patents
3 patentsUS6566612B2May 20, 2003
Method for direct chip attach by solder bumps and an underfill layer
IBM20 citations91
US6341418B1Jan 29, 2002
Method for direct chip attach by solder bumps and an underfill layer
IBM21 citations91
US6276596B1Aug 21, 2001
Low temperature solder column attach by injection molded solder and structure formed
IBM54 citations91