Inventor
CONG YU D
US4 patents
Patents
4 patentsUS6398929B1Jun 4, 2002
Plasma reactor and shields generating self-ionized plasma for sputtering
APPLIED MATERIALS INC128 citations98
US6582569B1Jun 24, 2003
Process for sputtering copper in a self ionized plasma
APPLIED MATERIALS INC75 citations97
US6413383B1Jul 2, 2002
Method for igniting a plasma in a sputter reactor
APPLIED MATERIALS INC92 citations97
US6893541B2May 17, 2005
Multi-step process for depositing copper seed layer in a via
APPLIED MATERIALS INC51 citations95