Inventor
PEARSON TOM E
US32 patents
⚠️ This page may combine multiple inventors who share the name “PEARSON TOM E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
26 patentsUS6501658B2Dec 31, 2002
Heatsink mounting with shock absorbers
INTEL CORP75 citations95
US6884939B2Apr 26, 2005
Constructing of an electronic assembly having a decoupling capacitor
INTEL CORP28 citations93
US7183496B2Feb 27, 2007
Soldered heat sink anchor and method of use
INTEL CORP18 citations92
US6903271B2Jun 7, 2005
Electronic assembly with thermally separated support
INTEL CORP18 citations92
US6734371B2May 11, 2004
Soldered heat sink anchor and method of use
INTEL CORP36 citations92
US6509530B2Jan 21, 2003
Via intersect pad for electronic components and methods of manufacture
INTEL CORP24 citations92
USD456249SApr 30, 2002
Plastic package with pull tab
INTEL CORP41 citations92
US7122891B2Oct 17, 2006
Ceramic embedded wireless antenna
INTEL CORP32 citations91
US7161238B2Jan 9, 2007
Structural reinforcement for electronic substrate
INTEL CORP17 citations84
US7251880B2Aug 7, 2007
Method and structure for identifying lead-free solder
INTEL CORP12 citations83
US7036217B2May 2, 2006
Methods of manufacturing via intersect pad for electronic components
INTEL CORP14 citations83
US6875931B2Apr 5, 2005
Retainer for circuit board assembly and method for using the same
INTEL CORP14 citations83
US6801436B2Oct 5, 2004
Extension mechanism and method for assembling overhanging components
INTEL CORP14 citations83
US6764325B2Jul 20, 2004
Zero insertion force heat-activated retention pin
INTEL CORP17 citations83
US6700800B2Mar 2, 2004
Retainer for circuit board assembly and method for using the same
INTEL CORP15 citations83
US6472612B2Oct 29, 2002
Printed circuit board with embedded thermocouple junctions
INTEL CORP17 citations83
US7230317B2Jun 12, 2007
Capacitor placement for integrated circuit packages
INTEL CORP11 citations80
US6791189B2Sep 14, 2004
Epoxy washer for retention of inverted SMT components
INTEL CORP5 citations73
US6691407B2Feb 17, 2004
Methods for retaining assembled components
INTEL CORP5 citations73
US6651869B2Nov 25, 2003
Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering
INTEL CORP7 citations72
US7185799B2Mar 6, 2007
Method of creating solder bar connections on electronic packages
INTEL CORP8 citations71
US7131193B2Nov 7, 2006
Heat-shrinkable retainer for PCB double-sided assembly
INTEL CORP3 citations62
US6917524B2Jul 12, 2005
Extension mechanism and method for assembling overhanging components
INTEL CORP4 citations62
US6906268B2Jun 14, 2005
Heat-shrinkable retainer for PCB double-sided assembly
INTEL CORP2 citations62
US6817878B2Nov 16, 2004
Zero mounting force solder-free connector/component and method
INTEL CORP3 citations62
US9420700B2Aug 16, 2016
Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies
INTEL CORP1 citations49