Inventor
REILEY TIMOTHY C
US25 patents
⚠️ This page may combine multiple inventors who share the name “REILEY TIMOTHY C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
18 patentsUS5134460AJul 28, 1992
Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding
IBM265 citations99
US6046882AApr 4, 2000
Solder balltape and method for making electrical connection between a head transducer and an electrical lead
IBM51 citations96
US5189363AFeb 23, 1993
Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester
IBM66 citations96
US4430690AFeb 7, 1984
Low inductance MLC capacitor with metal impregnation and solder bar contact
IBM56 citations96
US4814855AMar 21, 1989
Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
IBM64 citations95
US5028983AJul 2, 1991
Multilevel integrated circuit packaging structures
IBM78 citations93
US6318624B1Nov 20, 2001
Solder balltape and method for making electrical connection between a head transducer and an electrical lead
IBM30 citations92
US5142337AAug 25, 1992
Printing grey scale images
IBM39 citations92
US5135155AAug 4, 1992
Thermocompression bonding in integrated circuit packaging
IBM34 citations92
US5006917AApr 9, 1991
Thermocompression bonding in integrated circuit packaging
IBM25 citations92
US5539267AJul 23, 1996
Microfabricated rotary motion wobble motor and disk drive incorporating it
IBM24 citations91
US5374463ADec 20, 1994
Magnetic recording disk having a contiguous fullerene film and a protective overcoat
IBM31 citations89
US4956605ASep 11, 1990
Tab mounted chip burn-in apparatus
IBM32 citations89
US5242569ASep 7, 1993
Thermocompression bonding in integrated circuit packaging
IBM12 citations73
US5184183AFeb 2, 1993
Apparatus for printing grey scale images
IBM15 citations73
US4555285ANov 26, 1985
Forming patterns in metallic or ceramic substrates
IBM16 citations71
US5148261ASep 15, 1992
Thermocompression bonding in integrated circuit packaging
IBM5 citations62
US5120418AJun 9, 1992
Lead frame plating apparatus for thermocompression bonding
IBM3 citations62
HITACHI GLOBAL STORAGE TECH
4 patentsUS6802761B1Oct 12, 2004
Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication
HITACHI GLOBAL STORAGE TECH27 citations89
US6556380B2Apr 29, 2003
Silicon sliders with trapezoidal shape and drie process for fabrication
HITACHI GLOBAL STORAGE TECH34 citations86
US6643087B1Nov 4, 2003
Disk drive with improved retract circuit and method
HITACHI GLOBAL STORAGE TECH14 citations81
US7196016B2Mar 27, 2007
Fabrication process for preparing recording head sliders made from silicon substrates with SiO2 overcoats
HITACHI GLOBAL STORAGE TECH4 citations60