Inventor

DUBIN VALERY

US26 patents

⚠️ This page may combine multiple inventors who share the name “DUBIN VALERY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DUBIN VALERY

ADVANCED MICRO DEVICES INC

Self-encapsulated copper metallization

Method of electroplating a copper or copper alloy interconnect

Method for reducing oxidation of electroplating chamber contacts and improving uniform electroplating of a substrate

Pulse electroplating copper or copper alloys

Plated copper interconnect structure

Method for fabricating copper-aluminum metallization

Electroplating apparatus

Copper-aluminum metallization

Gas shielding during plating

Gas shielding during plating

Methods and apparatus for forming a copper interconnect

INTEL CORP

Methods for making interconnects and diffusion barriers in integrated circuits

Method for making interconnects and diffusion barriers in integrated circuits

Electroplating bath composition

Electroplating bath composition and method of using

Preparation of electroless deposition solutions

Method and apparatus for filling interlayer vias on ferroelectric polymer substrates

Large bumps for optical flip chips

Large bumps for optical flip chips

Forming a barrier layer in interconnect joints and structures formed thereby

Method of copper electroplating to improve gapfill

DUBIN VALERY

Method, apparatus and system for providing light source structures on a flexible substrate

Through substrate via (TSuV) structures and method of making the same

Method of making the light source structure in flexible substrate

CORNELL RES FOUNDATION INC

Electroless deposition of metal films with spray processor

AMD

Apparatus for forming a copper interconnect