Inventor
HIYAMA TSUTOMU
JP15 patents
Patents
15 patentsUS7988031B2Aug 2, 2011
Reflow furnace and heater for blowing hot air
SENJU METAL INDUSTRY CO14 citations82
US9744612B2Aug 29, 2017
Flux recovery device and soldering device
SENJU METAL INDUSTRY CO2 citations72
US9744613B2Aug 29, 2017
Flux recovery device and soldering device
SENJU METAL INDUSTRY CO3 citations72
US9511379B2Dec 6, 2016
Gas-intake-port array structure and soldering apparatus
SENJU METAL INDUSTRY CO6 citations71
US9485872B2Nov 1, 2016
Gas-blowing-hole array structure and soldering apparatus
SENJU METAL INDUSTRY CO5 citations71
US10252364B2Apr 9, 2019
Soldering apparatus and vacuum-soldering method
SENJU METAL INDUSTRY CO2 citations68
US7914595B2Mar 29, 2011
Fume removal method for a reflow furnace and a reflow furnace
SENJU METAL INDUSTRY CO6 citations60
US11007591B2May 18, 2021
Reflow soldering apparatus having independently openable main bodies
SENJU METAL INDUSTRY CO1 citations57
US12409409B2Sep 9, 2025
Condensation device, flux recovery device, soldering device, water vapor removing method, flux recovery method and solder processing method
SENJU METAL INDUSTRY CO0 citations50
US11235407B2Feb 1, 2022
Soldering apparatus and method of fixing gasket to the soldering apparatus
SENJU METAL INDUSTRY CO0 citations50
US10792607B2Oct 6, 2020
Flux recovery device, soldering device and method for removing flux
SENJU METAL INDUSTRY CO0 citations50
US9676048B2Jun 13, 2017
Vacuum soldering apparatus and control method therefor
SENJU METAL INDUSTRY CO0 citations47
US11819952B2Nov 21, 2023
Soldering apparatus and method of detecting failures of gasket
SENJU METAL INDUSTRY CO0 citations45
US10293439B2May 21, 2019
Soldering apparatus and flux-applying device
SENJU METAL INDUSTRY CO0 citations41
US10076041B2Sep 11, 2018
Soldering device
SENJU METAL INDUSTRY CO0 citations41