Inventor
SHIZUNO YOSHINORI
JP41 patents
⚠️ This page may combine multiple inventors who share the name “SHIZUNO YOSHINORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
OKI ELECTRIC IND CO LTD
20 patentsUS6177725B1Jan 23, 2001
Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same
OKI ELECTRIC IND CO LTD48 citations95
US5864174AJan 26, 1999
Semiconductor device having a die pad structure for preventing cracks in a molding resin
OKI ELECTRIC IND CO LTD53 citations95
US7087514B2Aug 8, 2006
Substrate having built-in semiconductor apparatus and manufacturing method thereof
OKI ELECTRIC IND CO LTD32 citations92
US6969916B2Nov 29, 2005
Substrate having built-in semiconductor apparatus and manufacturing method thereof
OKI ELECTRIC IND CO LTD23 citations92
US6888222B2May 3, 2005
Semiconductor device
OKI ELECTRIC IND CO LTD18 citations92
US6569755B2May 27, 2003
Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same
OKI ELECTRIC IND CO LTD16 citations92
US7329598B2Feb 12, 2008
Method of manufacturing a semiconductor device
OKI ELECTRIC IND CO LTD10 citations84
US7323778B2Jan 29, 2008
Semiconductor device with improved design freedom of external terminal
OKI ELECTRIC IND CO LTD10 citations84
US7151320B2Dec 19, 2006
Semiconductor device with improved design freedom of external terminal
OKI ELECTRIC IND CO LTD12 citations84
US7053486B2May 30, 2006
Semiconductor device with improved design freedom of external terminal
OKI ELECTRIC IND CO LTD11 citations84
US6914327B2Jul 5, 2005
Semiconductor device and manufacturing method thereof
OKI ELECTRIC IND CO LTD17 citations84
US6894384B1May 17, 2005
Semiconductor device and method of manufacturing the same
OKI ELECTRIC IND CO LTD16 citations84
US6841884B2Jan 11, 2005
Semiconductor device
OKI ELECTRIC IND CO LTD19 citations84
US6459145B1Oct 1, 2002
Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor
OKI ELECTRIC IND CO LTD13 citations81
US7227243B2Jun 5, 2007
Semiconductor device
OKI ELECTRIC IND CO LTD7 citations74
US7375397B2May 20, 2008
Semiconductor device having an SOI structure and method for manufacturing the same
OKI ELECTRIC IND CO LTD4 citations63
US6188133B1Feb 13, 2001
Semiconductor with plurality of connecting parts arranged on lower surface of a substrate
OKI ELECTRIC IND CO LTD4 citations63
US7049224B2May 23, 2006
Manufacturing method of electronic components embedded substrate
OKI ELECTRIC IND CO LTD1 citations52
US6852617B2Feb 8, 2005
Semiconductor device fabrication method
OKI ELECTRIC IND CO LTD0 citations52
US7193330B2Mar 20, 2007
Semiconductor device with improved design freedom of external terminal
OKI ELECTRIC IND CO LTD0 citations42
OKI SEMICONDUCTOR CO LTD
10 patentsUS7568390B2Aug 4, 2009
Semiconductor acceleration sensor device and method for manufacturing the same
OKI SEMICONDUCTOR CO LTD22 citations92
US8381394B2Feb 26, 2013
Circuit board with embedded component and method of manufacturing same
OKI SEMICONDUCTOR CO LTD11 citations84
US7989706B2Aug 2, 2011
Circuit board with embedded component and method of manufacturing same
OKI SEMICONDUCTOR CO LTD10 citations84
US7521807B2Apr 21, 2009
Semiconductor device with inclined through holes
OKI SEMICONDUCTOR CO LTD9 citations84
US7788976B2Sep 7, 2010
Semiconductor acceleration sensor device and method for manufacturing the same
OKI SEMICONDUCTOR CO LTD5 citations74
US7736944B2Jun 15, 2010
Semiconductor device with improved design freedom of external terminal
OKI SEMICONDUCTOR CO LTD3 citations63
US7569419B2Aug 4, 2009
Method for manufacturing semiconductor device that includes mounting chip on board and sealing with two resins
OKI SEMICONDUCTOR CO LTD2 citations63
US7566638B2Jul 28, 2009
Method of dicing a semiconductor device into plural chips
OKI SEMICONDUCTOR CO LTD2 citations63
US7525167B2Apr 28, 2009
Semiconductor device with simplified constitution
OKI SEMICONDUCTOR CO LTD6 citations63
US7919336B2Apr 5, 2011
Fabrication method for semiconductor device
OKI SEMICONDUCTOR CO LTD1 citations52
IBIDEN CO LTD
6 patentsUS9431347B2Aug 30, 2016
Wiring board and method for manufacturing the same
IBIDEN CO LTD28 citations92
US9893016B2Feb 13, 2018
Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the same
IBIDEN CO LTD8 citations84
US9425159B2Aug 23, 2016
Wiring board and method for manufacturing the same
IBIDEN CO LTD12 citations82
US9035463B2May 19, 2015
Wiring board and method for manufacturing the same
IBIDEN CO LTD4 citations68
US9433085B2Aug 30, 2016
Electronic component, method for manufacturing the same and method for manufacturing multilayer printed wiring board
IBIDEN CO LTD0 citations49
US9480157B2Oct 25, 2016
Wiring board and method for manufacturing the same
IBIDEN CO LTD0 citations48