P

Inventor

YAMAMOTO TAKUYA

JP66 patents
⚠️ This page may combine multiple inventors who share the name “YAMAMOTO TAKUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUI MINING & SMELTING CO

13 patents
US6270889B1Aug 7, 2001

Making and using an ultra-thin copper foil

MITSUI MINING & SMELTING CO64 citations95
US6989199B2Jan 24, 2006

Copper foil for printed-wiring board and copper-clad laminate using copper foil for printed-wiring board

MITSUI MINING & SMELTING CO20 citations93
US6660406B2Dec 9, 2003

Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit

MITSUI MINING & SMELTING CO26 citations92
US6319620B1Nov 20, 2001

Making and using an ultra-thin copper foil

MITSUI MINING & SMELTING CO22 citations92
US6541126B1Apr 1, 2003

Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil

MITSUI MINING & SMELTING CO30 citations90
US7524552B2Apr 28, 2009

Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer

MITSUI MINING & SMELTING CO8 citations83
US6902824B2Jun 7, 2005

Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same

MITSUI MINING & SMELTING CO9 citations74
US6548153B2Apr 15, 2003

Composite material used in making printed wiring boards

MITSUI MINING & SMELTING CO10 citations74
US6827867B2Dec 7, 2004

Method for manufacturing printed wiring board

MITSUI MINING & SMELTING CO4 citations63
US6716572B2Apr 6, 2004

Manufacturing process for printed wiring board

MITSUI MINING & SMELTING CO5 citations63
US7358189B2Apr 15, 2008

Copper clad laminate

MITSUI MINING & SMELTING CO2 citations61
US6652993B2Nov 25, 2003

Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer

MITSUI MINING & SMELTING CO2 citations60
US7851053B2Dec 14, 2010

Copper clad laminate

MITSUI MINING & SMELTING CO0 citations51

MINEBEA CO LTD

6 patents

FUJIFILM BUSINESS INNOVATION CORP

4 patents

NORITSU KOKI CO LTD

3 patents

TOYOTA JIDOSHOKKI KK

2 patents

TOYOTA MOTOR CO LTD

2 patents

SUMITOMO RUBBER IND

2 patents

FUJI ELECTRIC CO LTD

1 patent

SUMITOMO HEAVY INDUSTRIES

1 patent

ASAHI CHEMICAL IND

1 patent

MITSUBISHI MOTORS CORP

1 patent

SHARP KK

1 patent

TOKYO ELECTRON LTD

1 patent

EPPENDORF HIMAC TECH CO LTD

1 patent

YAMAHA CORP

1 patent

MINEBEA KK

1 patent

MITSUI MINING & SMELTING CO LTD

1 patent

SONY GROUP CORP

1 patent

UNIV HOKKAIDO NAT UNIV CORP

1 patent

NEC PLATFORMS LTD

1 patent

SONY CORP

1 patent

MITSUI KINZOKU COMPANY LTD

1 patent

STANLEY ELECTRIC CO LTD

1 patent

NEC ACCESS TECHNICA LTD

1 patent

YAMAMOTO TAKUYA

1 patent

Showing the top 50 of 66 patents by PatentIndex Score.