Inventor
OKUMURA TOMOMI
JP29 patents
⚠️ This page may combine multiple inventors who share the name “OKUMURA TOMOMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KADOGUCHI TAKUYA
9 patentsUS9059145B2Jun 16, 2015
Power module, method for manufacturing power module, and molding die
KADOGUCHI TAKUYA8 citations83
US8884411B2Nov 11, 2014
Semiconductor device and manufacturing method thereof
KADOGUCHI TAKUYA15 citations83
US8810026B2Aug 19, 2014
Semiconductor module
KADOGUCHI TAKUYA10 citations82
US8742556B2Jun 3, 2014
Semiconductor module
KADOGUCHI TAKUYA4 citations72
US9331001B2May 3, 2016
Semiconductor module
KADOGUCHI TAKUYA5 citations71
US9312211B2Apr 12, 2016
Semiconductor device and manufacturing method thereof
KADOGUCHI TAKUYA2 citations62
US9236330B2Jan 12, 2016
Power module
KADOGUCHI TAKUYA2 citations62
US8994167B2Mar 31, 2015
Semiconductor device
KADOGUCHI TAKUYA0 citations41
US9406593B2Aug 2, 2016
Lead frame, electric power converting device, semiconductor apparatus and method of manufacturing semiconductor apparatus
KADOGUCHI TAKUYA0 citations40
DENSO CORP
8 patentsUS9960096B2May 1, 2018
Semiconductor device
DENSO CORP9 citations84
US7800230B2Sep 21, 2010
Solder preform and electronic component
DENSO CORP12 citations84
US10026673B2Jul 17, 2018
Semiconductor device and power module
DENSO CORP5 citations73
US7235876B2Jun 26, 2007
Semiconductor device having metallic plate with groove
DENSO CORP8 citations73
US12553863B2Feb 17, 2026
Electronic device and power module
DENSO CORP0 citations53
US11742256B2Aug 29, 2023
Semiconductor device
DENSO CORP0 citations50
US12315825B2May 27, 2025
Semiconductor device having wire pieces in bonding member
DENSO CORP0 citations48
US10943859B2Mar 9, 2021
Semiconductor device
DENSO CORP0 citations46
TOYOTA MOTOR CO LTD
7 patentsUS9224662B2Dec 29, 2015
Semiconductor apparatus
TOYOTA MOTOR CO LTD4 citations72
US10103090B2Oct 16, 2018
Semiconductor device
TOYOTA MOTOR CO LTD1 citations51
US11545419B2Jan 3, 2023
Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminals
TOYOTA MOTOR CO LTD0 citations50
US10157815B2Dec 18, 2018
Semiconductor device
TOYOTA MOTOR CO LTD1 citations49
US10283429B2May 7, 2019
Semiconductor device
TOYOTA MOTOR CO LTD0 citations42
US9831160B2Nov 28, 2017
Semiconductor device
TOYOTA MOTOR CO LTD0 citations41
US10304777B2May 28, 2019
Semiconductor device having a plurality of semiconductor modules connected by a connection component
TOYOTA MOTOR CO LTD0 citations30