Inventor

KOMORI KIYOTAKA

JP17 patents

⚠️ This page may combine multiple inventors who share the name “KOMORI KIYOTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOMORI KIYOTAKA

MATSUSHITA ELECTRIC WORKS LTD

Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material

Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material

Composite dielectric and printed-circuit use substrate utilizing the same

Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board

Substrate for circuit board including the glass fibers as reinforcing material

Flame retardant resin composition

Epoxy resin composition, prepreg and metal-clad laminate

PANASONIC IP MAN CO LTD

Printed wiring board and method for manufacturing printed wiring board

Metal clad laminated plate and method for manufacturing metal clad laminated plate

Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foil

Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board

Method for manufacturing metal clad laminated board, method for manufacturing electronic circuit board, and rigid body pendulum type viscoelasticity measuring device

Multilayer printed wiring board and multilayer metal clad laminated board

MATSUDA TAKASHI

Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting

Prepreg, laminate, metal foil-clad laminate, circuit board and LED module

Thermosetting resin composition, prepreg, laminate, metal foil-clad laminate, and circuit board

KATO HIROAKI

Printed wiring board