Inventor

CHEN HAIGUANG

US37 patents

⚠️ This page may combine multiple inventors who share the name “CHEN HAIGUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN HAIGUANG

KLA TENCOR CORP

Detection of selected defects in relatively noisy inspection data

Process-induced distortion prediction and feedforward and feedback correction of overlay errors

System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking

System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking

Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool

Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool

Systems and methods for effective pattern wafer surface measurement and analysis using interferometry tool

Systems and methods for wafer surface feature detection and quantification

Hybrid phase unwrapping systems and methods for patterned wafer measurement

Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool

Systems and methods of advanced site-based nanotopography for wafer surface metrology

Process-induced distortion prediction and feedforward and feedback correction of overlay errors

Detection of selected defects in relatively noisy inspection data

KLA TENCOR TECH CORP

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

Systems and methods for characterizing a polishing process

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing

Methods and systems for detection of selected defects particularly in relatively noisy inspection data

In-situ end point detection for semiconductor wafer polishing

Methods and systems for detecting a presence of blobs on a specimen during a polishing process

Methods and systems for detection of selected defects particularly in relatively noisy inspection data

CHEN HAIGUANG

Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer

Systems and methods for wafer surface feature detection, classification and quantification with wafer geometry metrology tools

Methods and systems of object based metrology for advanced wafer surface nanotopography

Methods and systems for improved localized feature quantification in surface metrology tools

Systems and methods for wafer edge feature detection and quantification

UNIV CALIFORNIA

Adaptive digital image signal filtering

T2 restoration and noise suppression of hybrid MR images using wiener and linear prediction techniques

T2 restoration and noise suppression of hybrid MR images using Wiener and linear prediction techniques

BEIJING BAYI SPACE LCD TECH CO LTD

Polymer-stabilized liquid crystal composition and use thereof

Liquid crystal composition and application thereof

Liquid crystal composition containing 2-methyl-3,4,5-trifluorobenzene liquid crystal compound and application thereof

KLA TENCOR TECHNOLOGIES

Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad

LEHMAN KURT

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

JIANG TIANMENG

Liquid crystal composition and its application