Inventor
JIANG XIAOHONG
US34 patents
⚠️ This page may combine multiple inventors who share the name “JIANG XIAOHONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
9 patentsUS11641000B2May 2, 2023
Image sensor and manufacturing method thereof
UNITED MICROELECTRONICS CORP2 citations71
US10909299B1Feb 2, 2021
Method for stabilizing bandgap voltage
UNITED MICROELECTRONICS CORP0 citations62
US12563883B2Feb 24, 2026
Image sensor and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations60
US12176375B2Dec 24, 2024
Image sensor structure including nanowire structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP1 citations60
US12094896B2Sep 17, 2024
Photosensitive semiconductor device including heterojunction photodiode
UNITED MICROELECTRONICS CORP0 citations60
US12080734B2Sep 3, 2024
Photosensitive semiconductor device including heterojunction photodiode
UNITED MICROELECTRONICS CORP0 citations60
US11527561B2Dec 13, 2022
Photosensitive semiconductor device including top surface photodiode
UNITED MICROELECTRONICS CORP0 citations60
US11101361B1Aug 24, 2021
Gate-all-around (GAA) transistor and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations60
US12433042B2Sep 30, 2025
Image sensor structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations51
ALTERA CORP
8 patentsUS9425149B1Aug 23, 2016
Integrated circuit package routing with reduced crosstalk
ALTERA CORP26 citations94
US9245835B1Jan 26, 2016
Integrated circuit package with reduced pad capacitance
ALTERA CORP15 citations84
US8368174B1Feb 5, 2013
Compensation network using an on-die compensation inductor
ALTERA CORP12 citations84
US9842813B2Dec 12, 2017
Tranmission line bridge interconnects
ALTERA CORP3 citations73
US9331370B1May 3, 2016
Multilayer integrated circuit packages with localized air structures
ALTERA CORP5 citations73
US7752587B2Jul 6, 2010
Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages
ALTERA CORP2 citations63
US8723293B1May 13, 2014
Compensation network using an on-die compensation inductor
ALTERA CORP1 citations52
US9941201B1Apr 10, 2018
Magnetically decoupled inductor structures
ALTERA CORP0 citations45
SHENZHEN YOUQING TECH CO LTD
6 patentsUSD930375SSep 14, 2021
Bike saddle
SHENZHEN YOUQING TECH CO LTD22 citations93
USD974783SJan 10, 2023
Bike saddle
SHENZHEN YOUQING TECH CO LTD10 citations85
USD949584SApr 26, 2022
Bike saddle
SHENZHEN YOUQING TECH CO LTD11 citations85
USD1043152SSep 24, 2024
Recliner chair
SHENZHEN YOUQING TECH CO LTD4 citations74
USD981121SMar 21, 2023
Bike saddle
SHENZHEN YOUQING TECH CO LTD4 citations74
USD974058SJan 3, 2023
Bike saddle
SHENZHEN YOUQING TECH CO LTD4 citations74
JIANG XIAOHONG
4 patentsUS8841561B1Sep 23, 2014
High performance PCB
JIANG XIAOHONG9 citations83
US8502386B2Aug 6, 2013
Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages
JIANG XIAOHONG6 citations83
US8294259B2Oct 23, 2012
Interconnect pattern for transceiver package
JIANG XIAOHONG12 citations83
US9401330B1Jul 26, 2016
IC package with non-uniform dielectric layer thickness
JIANG XIAOHONG3 citations72
CHARTERED SEMICONDUCTOR MFG
3 patentsUS7253483B2Aug 7, 2007
Semiconductor device layout and channeling implant process
CHARTERED SEMICONDUCTOR MFG2 citations62
US6972236B2Dec 6, 2005
Semiconductor device layout and channeling implant process
CHARTERED SEMICONDUCTOR MFG2 citations62
US7573099B2Aug 11, 2009
Semiconductor device layout and channeling implant process
CHARTERED SEMICONDUCTOR MFG0 citations52