Inventor

SHI HONG

US65 patents

⚠️ This page may combine multiple inventors who share the name “SHI HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHI HONG

BROADCOM CORP

Self-calibrating direct conversion transmitter

Radio employing a self calibrating transmitter with reuse of receiver circuitry

Radio frequency integrated circuit

Timing based LNA gain adjustment in an RF receiver to compensate for intermodulation interference

DC offset correcting in a direct conversion or very low IF receiver

Radio frequency integrated circuit

Timing based LNA gain adjustment in an RF receiver to compensate for intermodulation interference

Transmitter method, apparatus, and frequency plan for minimizing spurious energy

Calibrating an RF transmitter

Radio frequency transmitter having translational loop phase equalization

LNA gain adjustment in an RF receiver to compensate for intermodulation interference

Translational loop transmitter architecture employing channel power ratio measurements for modulation accuracy calibration

Translational loop transmitter architecture employing channel power ratio measurements for modulation accuracy calibration

Transmitter method, apparatus, and frequency plan for minimizing spurious energy

LNA gain adjustment in an RF receiver to compensate for intermodulation interference

Radio receiver utilizing a single analog to digital converter

ALTERA CORP

Integrated circuit package routing with reduced crosstalk

Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing

Integrated circuit package with reduced pad capacitance

Compensation network using an on-die compensation inductor

Method of optimizing interconnect distribution to improve signal integrity

BGA package with wiring schemes having reduced current loop paths to improve cross talk control and characteristic impedance

Substrate via patterns for optimal power distribution and manufacturability in semiconductor die packages

On-package edge-mount power decoupling and implementation with novel substrate design for FPGA and ASIC devices

Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages

Return loss techniques in wirebond packages for high-speed data communications

XILINX INC

Method and apparatus of package enabled ESD protection

Power-ground co-reference transceiver structure to deliver ultra-low crosstalk

Chip package with near-die integrated passive device

Integrated circuit package with voltage droop mitigation

Core cavity noise isolation structure for use in chip packages

Modular stacked silicon package assembly

In-package passive inductive element for reflection mitigation

ERICSSON INC

Adaptive rate channel scanning method for TDMA wireless communications

Adaptive threshold of handoff in mobile telecommunication systems

Methods and systems of performing system channel planning for wireless local loop communication

Antenna diversity switching system and method for selecting an antenna through a programmed evaluation

JIANG XIAOHONG

High performance PCB

Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages

Interconnect pattern for transceiver package

IC package with non-uniform dielectric layer thickness

UNIV CENTRAL FLORIDA

Multiwavelength modelocked semiconductor diode laser

Multiwavelength modelocked lasers

LIU HUI

Tunable power distribution network and method of use thereof

Power distribution network

WANG BONNIE I

Adjustable drive strength input-output buffer circuitry

UNIV TIANJIN

Adaptive control artificial wavemaking device

SHI HONG

Techniques for attenuating resonance induced impedance in integrated circuits

PIRELLI GENERAL PLC

Monitoring tension in tensioned longitudinally moving elongate elements

LI ZHE

Methods and apparatus for transceiver power noise reduction