Inventor
PANTUSO DANIEL
US12 patents
Patents
12 patentsUS6525419B1Feb 25, 2003
Thermally coupling electrically decoupling cooling device for integrated circuits
INTEL CORP45 citations94
US6646340B2Nov 11, 2003
Thermally coupling electrically decoupling cooling device for integrated circuits
INTEL CORP21 citations90
US11594524B2Feb 28, 2023
Fabrication and use of through silicon vias on double sided interconnect device
INTEL CORP6 citations85
US11251156B2Feb 15, 2022
Fabrication and use of through silicon vias on double sided interconnect device
INTEL CORP8 citations85
US11056356B1Jul 6, 2021
Fluid viscosity control during wafer bonding
INTEL CORP5 citations70
US10720345B1Jul 21, 2020
Wafer to wafer bonding with low wafer distortion
INTEL CORP3 citations69
US9343411B2May 17, 2016
Techniques for enhancing fracture resistance of interconnects
INTEL CORP3 citations68
US11171057B2Nov 9, 2021
Semiconductor fin design to mitigate fin collapse
INTEL CORP0 citations62
US11195719B2Dec 7, 2021
Reducing in-plane distortion from wafer to wafer bonding using a dummy wafer
INTEL CORP0 citations60
US10825752B2Nov 3, 2020
Integrated thermoelectric cooling
INTEL CORP0 citations48
US9691716B2Jun 27, 2017
Techniques for enhancing fracture resistance of interconnects
INTEL CORP0 citations48
US10707186B1Jul 7, 2020
Compliant layer for wafer to wafer bonding
INTEL CORP0 citations40