Inventor

ZHONG CHONGHUA

US33 patents

⚠️ This page may combine multiple inventors who share the name “ZHONG CHONGHUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHONG CHONGHUA

APPLE INC

System in package fan out stacking architecture and process flow

High density interconnection using fanout interposer chiplet

Double side mounting memory integration in thin low warpage fanout package

Structure and method for fabricating a computing system with an integrated voltage regulator module

High bandwidth die to die interconnect with package area reduction

High bandwidth die to die interconnect with package area reduction

Integrated circuit die decoupling system with reduced inductance

High bandwidth die to die interconnect with package area reduction

High density interconnection using fanout interposer chiplet

High density interconnection using fanout interposer chiplet

Trimmable banked capacitor

Structure and method for fabricating a computing system with an integrated voltage regulator module

3D thin profile pre-stacking architecture using reconstitution method

Dual-sided silicon integrated passive devices

Structure and method for fabricating a computing system with an integrated voltage regulator module

Structure and method for fabricating a computing system with an integrated voltage regulator module

Structure and method for fabricating a computing system with an integrated voltage regulator module

Double side mounted large MCM package with memory channel length reduction

Double side mounted large MCM package with memory channel length reduction

Scalable extreme large size substrate integration

Dual-sided silicon integrated passive devices

BROADCOM CORP

Low voltage drop and high thermal performance ball grid array package

Low voltage drop and high thermal performance ball grid array package

Wafer level semiconductor package

Integrated circuit package substrate having configurable bond pads

Fabricating a wafer level semiconductor package having a pre-formed dielectric layer

Wideband power efficient high transmission power radio frequency (RF) transmitter

ZHONG CHONGHUA

Thermal enhanced high density flip chip package

Integrated circuit package substrate having configurable bond pads

HU KUNZHONG

Wafer level package resistance monitor scheme

GOMEZ RAY RAMON

Wideband power efficient high transmission power radio frequency (RF) transmitter

ZHAO SAM ZIQUN

IC package sacrificial structures for crack propagation confinement

HU KEVIN KUNZHONG

Method of fabricating a wafer level semiconductor package having a pre-formed dielectric layer