Inventor

PAK JUNSO

KR4 patents

Patents

4 patents

US11908758B2Feb 20, 2024

Semiconductor package including dual stiffener

SAMSUNG ELECTRONICS CO LTD0 citations59

US11908810B2Feb 20, 2024

Hybrid semiconductor device and electronic device

SAMSUNG ELECTRONICS CO LTD0 citations48

US12213256B2Jan 28, 2025

Semiconductor package for improving power integrity characteristics

SAMSUNG ELECTRONICS CO LTD0 citations47

US12224260B2Feb 11, 2025

Semiconductor package including a dualized signal wiring structure

SAMSUNG ELECTRONICS CO LTD0 citations41