Inventor

LEE HEESEOK

KR32 patents

⚠️ This page may combine multiple inventors who share the name “LEE HEESEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE HEESEOK

SAMSUNG ELECTRONICS CO LTD

Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structure

Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

Semiconductor packages and methods of forming the same

Semiconductor package and method of manufacturing the same

Antenna module and electronic system including the same

Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

Semiconductor package

Semiconductor package

Semiconductor package and method of manufacturing the same

Semiconductor package having improved heat dissipation characteristics

Semiconductor package including composite molding structure

Semiconductor package including composite molding structure

Package substrate and semiconductor package having the same

Semiconductor package

Semiconductor package

Semiconductor package including dual stiffener

Semiconductor devices including power connection lines

Semiconductor memory device for improving signal integrity issue in center pad type of stacked chip structure

Hybrid semiconductor device and electronic device

Semiconductor package for improving power integrity characteristics

Semiconductor package and semiconductor device including the same

Semiconductor package and method of manufacturing the same

Wiring boards and semiconductor modules including the same

Semiconductor package including a dualized signal wiring structure

Semiconductor packages including thermal blocks

KIM YONGHOON

Circuit board and semiconductor module including the same

Semiconductor packages including heat slugs

LEE HEESEOK

Semiconductor package including a plurality of stacked semiconductor devices

KIM TONGSUK

Semiconductor packages and methods of forming the same

SEO JANGMEE

Semiconductor package and method of fabricating the same

YOU SE-HO

Package substrate and semiconductor package having the same