Inventor
ZIADEH BASSAM
US6 patents
⚠️ This page may combine multiple inventors who share the name “ZIADEH BASSAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
5 patentsUS10580758B2Mar 3, 2020
Scalable package architecture and associated techniques and configurations
INTEL CORP1 citations70
US9793244B2Oct 17, 2017
Scalable package architecture and associated techniques and configurations
INTEL CORP1 citations60
US12130482B2Oct 29, 2024
Hydrophobic feature to control adhesive flow
INTEL CORP0 citations57
US10483177B2Nov 19, 2019
Package for a semiconductor die, method for making a die packaging bare die tape and method for semiconductor die packaging
INTEL CORP1 citations54
US10037976B2Jul 31, 2018
Scalable package architecture and associated techniques and configurations
INTEL CORP0 citations49